Magnum E2 supports LPDDR6, DDR6, GDDR7 and NAND flash testing from qualification through high-volume manufacturing.
Teradyne Inc. has announced Magnum E2, a high-speed memory test system for DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7 and NAND flash. Based on Teradyne’s Near-DUT Test (NDT) architecture, which also supports the Magnum EPIC platform, Magnum E2 is available in production and engineering configurations for qualification through high-volume manufacturing on a common hardware and software platform.
As memory devices for AI data centers move to higher speeds, wider I/O and PAM3 signaling, manufacturers need test systems with higher pin counts, greater parallelism and support for NRZ and PAM3 signals while maintaining signal integrity. Magnum E2 is designed to address these testing requirements.
Key features and benefits
- Signal integrity at operating speed: Digital instruments are positioned close to the device under test to help maintain signal quality and AC margin.
- Support for current and emerging protocols: The system supports NRZ, PAM3 and PAM4 signaling through a programmable automatic pattern generation architecture. The common hardware is designed to support current and future DRAM and NAND standards without requiring a new tester platform.
- Memory and logic testing on one platform: Integrated logic test capabilities support memory and logic testing on the same system, which can reduce the number of test insertions and simplify test programs.
As memory devices evolve from AI data centers to edge systems, manufacturers need test systems that support higher speeds, flexible signaling, increased parallelism and a broad range of protocols. Magnum E2 provides a common platform for current memory testing requirements and future device development.
For more information, visit teradyne.com.
