Nexora offers 12 MP and 16 MP options with BSI pixels, 3D stacking, and LVDS connectivity for machine vision cameras.
Teledyne e2v announced Nexora, a new family of CMOS image sensors that delivers high sensitivity, high-speed imaging and low power consumption for demanding machine vision applications.
Available in 12 MP (4,096 by 3,072) and 16 MP (4,096 by 4,096) resolutions, in both monochrome and color versions, Nexora is designed for applications that require sharp images at very high speeds. These include high-resolution machine vision, intelligent traffic systems, and outdoor surveillance.
At the heart of Nexora is Teledyne e2v’s proprietary backside-illuminated (BSI) pixel technology. By positioning the photodiode closer to the incoming light and maximizing the light-sensitive area of each pixel, the sensor achieves higher light-collection efficiency than conventional front-side illuminated (FSI) architectures. This results in quantum efficiency (QE) of up to 73% at 550 nm and 15% at 940 nm, improving performance in challenging lighting conditions and near-infrared applications.
The Nexora family also features Teledyne e2v’s 3D-stacked sensor architecture, which integrates multiple functions within a compact, multilayer structure. This approach increases design flexibility while helping camera manufacturers develop smaller, higher-performance imaging systems.
Nexora incorporates a versatile LVDS interface that is compatible with a wide range of FPGAs and image signal processors. It is housed in a compact 23 by 21.5 mm package that is compatible with 29 by 29 mm² cameras and standard C-mount optics.
See Nexora at VISION in Stuttgart, Germany, Oct. 6-8, 2026. Visit us in Hall 8, Booth 8B10, or contact us online for more information.
Documentation and samples are available now upon request.
For more information, visit teledyne-e2v.com.
