COMSOL releases Multiphysics 6.4 with new modules and GPU tools

Version 6.4 adds GPU-accelerated solvers, a Granular Flow Module, and updates to workflows for geometry, meshing and visualization.

COMSOL announced the release of COMSOL Multiphysics version 6.4, which adds new features, performance updates and expanded tools for multiphysics modeling and simulation app development. The latest version includes improved solver performance through the NVIDIA CUDA direct sparse solver, NVIDIA cuDSS, support for NVIDIA AI infrastructure, a new Granular Flow Module and a new framework for time-explicit dynamic analysis.

In addition to the new features, version 6.4 includes updates to geometry, meshing and visualization workflows. The release also adds optional large language model–assisted simulation. The Chatbot window now supports connections to GPT-5, DeepSeek, Google Gemini, Anthropic Claude and other OpenAI API–compatible models, allowing users to access documentation and information from the active simulation in one place.

In-cabin acoustic simulations, such as the one shown here of a car cabin, benefit from NVIDIA GPU acceleration in version 6.4, which offers faster and more scalable analyses.

Faster simulations with GPU-accelerated solvers

Version 6.4 introduces NVIDIA GPU acceleration for direct solvers and expands multi-GPU support for acoustics simulations. The cuDSS sparse direct solver, designed for hybrid CPU–GPU computation, supports recent NVIDIA GPU architectures and can provide speed improvements depending on hardware and model size. GPU acceleration can be useful for both single-physics and multiphysics simulations, especially when solver stability is important.

The NVIDIA CUDA-X cuBLAS library also accelerates transient pressure acoustics simulations, which can now run on multiple GPUs in a single system or on a GPU cluster. These updates reduce computation time for larger models.

The new Granular Flow Module can be used to analyze mixing performance and quantify homogeneity in industrial blending equipment.

Granular flow modeling for particle-based processes

The Granular Flow Module, a new add-on based on the discrete element method (DEM), allows users to model particle motion in applications such as hopper discharge, silo storage, chute transport, powder spreading and mixing. It can be applied in fields including pharmaceuticals, chemical processing, agriculture, mining and additive manufacturing.

The module accounts for particle-level behavior such as collisions, adhesion and rotational resistance, and provides controls for particle properties, release conditions and wall interactions. These capabilities help evaluate flow uniformity, packing density, mixing behavior and wall stresses, and can identify issues such as blockages or uneven flow.

Explicit structural dynamics capabilities enable a new class of simulations in COMSOL Multiphysics version 6.4, including drop tests of handheld consumer electronics.

Time-explicit dynamic analysis framework

Version 6.4 adds a framework for time-explicit dynamic analysis to simulate fast, transient and highly nonlinear events, including impact, crushing and elastic wave propagation. The explicit approach supports nonlinear structural materials such as hyperelastic, plastic, viscoplastic and creep models, and can be used with dynamic fracture simulations.

To simplify setup for mechanical assemblies, the software can automatically detect and define contact conditions between interacting components.

Updates across the product suite

Other changes in COMSOL Multiphysics version 6.4 include:

  • Improved quad-dominant and swept meshing
  • Support for spatially varying transparency
  • Array-based plot layouts
  • More efficient development of large simulation apps
  • New optimization options for time-dependent and parametric studies
  • Export of network parameters for DNN surrogate models
  • Surrogate model data generation on clusters
  • Import of CFD data in CGNS format
  • Frequency- and time-dependent uncertainty quantification

For more information, visit comsol.com.

Written by

Puja Mitra

Puja Mitra has an MBA in Marketing and HR as well as an MA in Economics. As a Managing Editor, she has experience managing CAD, CAM, and CAE directories. She also handles design, BIM, manufacturing, digital transformation, and computing news. With over 14 years of editing experience, she has a particular interest in content and technical writing.