Zuken and IBM signed a joint development deal on 3D IC packaging, AI acceleration, and EDA advances.
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The center, headquartered at the Albany NanoTech Complex in Albany, NY, focuses on developing advanced chips and systems, including semiconductor packaging, to support the high-speed processing needed for AI applications.
Zuken has signed an agreement with IBM for joint research and development of heterogeneous chip integration packaging solutions, which support AI accelerator architecture. The collaboration will focus on 3D integrated circuit (3DIC) packaging design for advanced semiconductors and improving electronic design automation (EDA) workflows.
Zuken will assist in evaluating a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will help develop materials, model processes, and refine integration methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement includes reliability testing, performance simulation, and hardware validation.
Zuken views 3DIC packaging design as a key enabler for future technological innovation and continues to invest in R&D. Open collaboration with industry consortiums is essential, and the partnership with IBM Research supports efforts to expand technological capabilities and deliver innovative solutions to customers.
For more information, visit zuken.com.
