New chips temperature range from -40° to 105°C with capacity up to 64GB for industrial applications.
Toshiba has announced the launch of the new JEDEC e·MMC (embedded Multi-Media Card) Version 5.1 compliant embedded NAND flash memory chips for applications including PLCs, computer-on-modules, factory automation equipment and consumer applications.
The demand for high temperature support in both the consumer and industrial markets is growing, Toshiba said in a statement. In response, the new line extends the operational temperature limit of Toshiba’s current line-up from 85° to 105° C (185° to 221° F). The full operational temperature range of the JEDEC e·MMC chips is -40° to 105° C (-40° to 221° F), suitable for high-temperature industrial applications.
The new chips offered in an 11.5mm x 13.0mm 153Ball FBGA package, with thicknesses ranging from 0.8mm to 1.2mm, depending on the capacity. Fabricated with 15nm process technology, the chips will offer densities of 8GB, 16GB, 32GB, and 64GB.
e·MMC products integrate both flash memory and a flash memory controller onto the same silicon die. This simplifies product development, as the chip handles essential functions including writing block management, error correction and driver software.
Additionally, e·MMC Version 5.1 standardizes new features including BKOPS control, cache barrier, cache flushing report, large RPMB write and command queuing.
The e·MMC Version 5.1 also supports AEC-Q100 Grade2 requirements to meet automotive applications.
Though sample shipments have already begun, mass production of the new flash memory products isn’t scheduled to begin until March 2017.
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