Industry News

Texas Instruments unveils power-management chips for data centers

First 48V hot-swap eFuse with power-path protection supports 6kW+ designs.

Texas Instruments (TI) introduced new power-management chips to support the increasing power demands of modern data centers. As advanced computing and AI applications expand, data centers require efficient, high-density power solutions. TI’s new TPS1685 is a 48V integrated hot-swap eFuse with power-path protection, designed for data center hardware and processing needs. To support data center design, TI also released a new family of integrated GaN power stages—the LMG3650R035, LMG3650R025 and LMG3650R070—available in TOLL packaging, a common industry format.

TI’s new TPS1685 hot-swap eFuse supports more efficient and power-dense data centers.

Support high-power 48V systems with scalable protection

With increasing power requirements, data center designers are adopting 48V power architectures to improve efficiency and scalability for components such as CPUs, GPUs, and AI accelerators. TI’s 48V stackable integrated hot-swap eFuse with power-path protection helps designers address high-power (>6kW) processing needs with a scalable device that supports compact designs, reducing size compared to existing hot-swap controllers.

TI GaN power stages in TOLL packaging for efficient integration

In addition, TI introduced a new family of integrated GaN power stages. The LMG3650R035, LMG3650R070, and LMG3650R025 use TI GaN technology in an industry-standard TOLL package, enabling designers to integrate TI GaN efficiency without requiring extensive design changes.


The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (>98%) and high-power density (>100W/in3). They include protection features such as over-current, short-circuit, and over-temperature protection. These features are particularly useful in AC/DC applications like server power, where space constraints require efficient power management.

Reimagining power density and efficiency at APEC 2025

At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including:

  • Dell’s 1.8kW server power-supply unit (PSU) with TI GaN power stages: Dell’s first high-efficiency 12V PSU design uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency.
  • Vertiv’s 5.5kW server PSU: Part of Vertiv’s PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack.
  • Greatwall’s 8kW PSU: To help designers increase power density, Greatwall and TI co-developed an 8kW open-rack PSU using TI GaN technology and TI C2000™ real-time microcontrollers.

For more information, visit TI.com.