Calibre 3DStress delivers early analysis/simulation of chip/package interactions at all stages of the design process.
Siemens Digital Industries Software has added two new tools to its Electronic Design Automation (EDA) portfolio to support the design and production of 2.5D and 3D Integrated Circuits (ICs). The Innovator3D IC solution suite allows IC designers to author, simulate, and manage heterogeneously integrated 2.5D/3D IC designs. The Calibre 3DStress software uses thermo-mechanical analysis to help identify how stress at the transistor level may affect electrical performance. These tools are intended to support more effective design and manufacturing processes for advanced ICs.
Innovator3D IC solution suite
Siemens’ new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP.Â
Built on an AI-infused user experience offering extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+ million pin designs, the new Innovator3D IC solution suite is comprised of the Innovator3D IC Integrator, a consolidated cockpit for constructing a digital twin using a unified data model for design planning, prototyping and predictive analysis; the Innovator3D IC Layout solution for correct-by-construction package interposer and substrate implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and die-to-die interface compliance analysis; and the Innovator3D IC Data Management solution, for the work-in-progress management of designs and design data IP.
Calibre 3DStress
With the thinner dies and higher package processing temperatures of 2.5D/3D IC architectures, IC designers have discovered that designs validated and tested at the die level often no longer conform to specifications after packaging reflows.
Engineered to address this challenge, Calibre 3DStress supports accurate, transistor-level analysis, verification, and debugging of thermo-mechanical stresses and warpage in the context of 3D IC packaging, allowing chip designers to evaluate how chip-package interaction will affect the functionality of their designs earlier in the development cycle. This foresight not only prevents future failures but also optimizes the design for better performance and durability.
Expanding on the 2024 launch of Calibre 3DThermal, Calibre 3DStress adds to Siemens’ Multiphysics solution by enabling earlier visibility into design and electrical behavior. Unlike package-level stress tools, it identifies stress at the transistor level to help ensure that packaging processes and product functions do not affect circuit performance.
Calibre 3DStress represents an important part of Siemens’ 3D IC multi-physics software portfolio and a foundational part of Siemens’ IC digital twin and semiconductor development workflows. It delivers an innovative combination of industry-standard Calibre physical verification functionality with a native and highly advanced mechanical solver to evaluate stresses in IC structures and materials.
To learn more about Siemens’ broad portfolio of solutions for 2.5D/3D IC architectures, visit eda.sw.siemens.com/en-US/ic-packaging/3d-ic-design.
