Mosaic Microsystems and NHanced Semiconductor join Siemens' OSAT Alliance to support U.S. semiconductor industry efforts.
Siemens Digital Industries Software announced new members joining its OSAT Alliance program. The initiative supports outsourced semiconductor assembly and test (OSAT) providers in developing, validating, and maintaining integrated circuit (IC) package assembly design kits (ADKs), aiming to assist fabless semiconductor and systems companies and contribute to domestic semiconductor supply chains.
The OSAT Alliance supports customers in using Siemens’ EDA tools—such as Calibre, Innovator3D IC, HyperLynx, and Xpedition Package Designer—by promoting the development of design flows and assembly design kits (ADKs). This helps streamline design, verification, and validation processes for advanced semiconductor integration technologies.
Mosaic Microsystems, headquartered in Rochester NY, will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology for a range of microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies.
NHanced Semiconductors in Morrisville NC and Odon, Indiana will employ Siemens EDA technologies to develop ADKs for their silicon interposer-based technology which targets the industrial, medical, military and scientific industry segments.
For more information about how Mosaic Microsystems and NHanced Semiconductors have joined Siemens, ASE, Amkor and DECA Technologies in the OSAT Alliance program, visit eda.sw.siemens.com/en-US/ic-packaging/osat-alliance.
