The annual award honors individuals for 15+ years of impactful contributions.
Promex Industries, Inc. announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS). The annual award recognizes individuals who have made impactful, sustained contributions to the field over 15 years or more, such as leading the development of major new processes in electronic manufacturing or significantly improving the yield or reliability of established processes.
Otte has dedicated more than five decades to advancing electronics packaging, shaping the industry with groundbreaking innovations. One of his earliest achievements was leading the development and introduction of multichip modules (MCMs) at Advanced Packaging Systems in the ’90s, laying the foundation for increasingly sophisticated packaging techniques. Building on that success, Otte continued pioneering methods for creating smaller, denser, and more complex assemblies that integrated semiconductor die alongside non-electronic components—an approach that marked the beginning of heterogeneous integration.
His contributions included supporting industry technical roadmaps: IEEE International Technology Roadmap for Semiconductors (ITRS), IEEE Heterogeneous Integration Roadmap (HI), and the iNEMI and International Photonic System Roadmaps (IPSR). The latter anticipated the integration of optical technologies to enhance data rates while reducing power consumption. Through his innovative work, Otte has contributed to advancements that have significantly improved the functionality, efficiency, and reliability of electronic devices across the medical, biotech, communications, and data processing industries—helping shape the future of smaller, smarter, and more dependable technology.
The award will be presented during the EPS Luncheon at the Electronic Components and Technology Conference (ECTC) in Dallas, Texas, on May 29, 2025.
For more information, visit promex-ind.com.
