Coping with signal integrity (SI) and electromagnetic interface (EMI) issues are a daily challenge for PCB design engineers.
Coping with signal integrity (SI) and electromagnetic interface (EMI) issues are a daily challenge for PCB design engineers. End-product problems, such as emissions testing failures or signal-integrity-related failures, can be avoided by using design rule checks (DRCs).
This paper reviews the common causes of SI/EMI challenges and how they can be easily identified.
- Common causes of EMI in PCBs
- Common causes of SI issues in PCBs
- How to perform DRCs to avoid these problems
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