Tackling Thermal Design Challenges of Avionic Electronics

With every one degree rise in temperature, the risk of failure of an avionic component increases.

With every one degree rise in temperature, the risk of failure of an avionic component increases.

As avionic electronics become denser and higher powered, system designers have to pay more attention to thermal management.

The thermal characteristics of avionic components directly influence overall thermal management, dictating the size, weight, and power (SWaP) of the overall system. They can make the difference between function and failure.

The design engineering team has to weigh the lower price of commercial off-the-shelf avionic components against SWaP and reliability to ensure that the whole cooling system is viable.

This white paper discusses how thermal transient testing combined with computational fluid dynamics (CFD) can help find this balance and ensure that safety-critical devices work within their prescribed temperature limits.

This white paper also highlights industry examples that illustrate how this process is helping companies develop faster, more efficient, and cost-effective avionics systems.

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