System-Level Connectivity Management & Verification of 3D IC Heterogeneous Assemblies

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.

Integrating multiple dies and substrates into a single package continues to be a major focus of the semiconductors industry. Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.

Designers need an EDA platform such as Xpedition Substrate Integrator (xSI) that can aggregate the different formats for a multi-substrate system and generate a system-level netlist that drives assembly verification. Assembly verification using Xpedition Substrate Integrator and Calibre 3DSTACK is a “designer-centric” approach, as it is agnostic to the different die technology nodes and substrate manufacturers.

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