The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling mechanisms.
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling mechanisms.
Overheating causes the chips to prematurely fail—and failure of only one chip can disable the entire equipment.
As functionality has increased, the associated heat dissipation has escalated to the extent that it can limit the pace of electronics development.
In this 12 page white paper, the CFD experts at Mentor Graphics examine the issues that arise from mechanical designers using mechanical design software while the electronics designers use electronics design software. The white paper explores how superior processes and software tools can enable their collaboration through the design process with emphasis on solving thermal design issues.
Download this white paper to learn more about thermal design issues from conceptual design to final product, and proposed solutions to tackle thermal design challenges for electronic products.
Complete the form to download your white paper. Your download is sponsored by Mentor Graphics.
