Reliability in Avionics Systems – Managing Excessive Heat

This white paper addresses one of the main factors that adversely affects the performance of semiconductor chips: overheating.

This white paper addresses one of the main factors that adversely affects the performance of semiconductor chips: overheating. Overheating causes the chip to prematurely fail and as a result can disable an entire avionics system.

The combination of higher power requirements and smaller form factors create a real challenge for heat dissipation. Add to that the ever-shortening product development times, and it’s clear that avionics designers need a new way to analyze the thermal flows around PCBs in avionics systems. To be useful in this environment, and thermal analysis tools have to handle the complexity of modern avionic electronics, while still being accessible to mechanical engineers who are designing around the electronic components. This white paper sets out several specific design challenges around thermal analysis including geometry capture, scale disparity, layer thickness, material properties and mesh generation.

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