Historically, component temperature has been correlated with reliability, with early studies relating field failure rates to component temperature.
Historically, component temperature has been correlated with reliability, with early studies relating field failure rates to component temperature. More recently physics-based reliability prediction has related failure rates of electronic assemblies to the magnitude of temperature change over an operational cycle (power-on, power-off, power-on…), and rate of temperature change, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, improve performance, or avoid problems during operation, accurate prediction of component temperatures helps thermal designers to achieve their goals.
Reliable, accurate prediction of component temperatures allows designers to understand how close the design values come to the maximum allowable temperature. This white paper discusses how to achieve high fidelity component temperature prediction across the design flow, and to gain increase confidence in the final simulation results.
To read this free white paper, please fill out the form on the right. Mentor Graphics has sponsored this download.
