Pragmatic Semiconductor expands NFC connectivity with flexible chips

Pragmatic NFC Connect product innovation expands market opportunities for edge and item-level intelligence at scale.

Pragmatic Semiconductor Ltd. announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect. NFC Connect redefines the parameters of NFC connectivity, unlocking seamless, item-level intelligence for mass-market products – traditionally constrained by cost, supply chain and sustainability challenges.

NFC Connect, Pragmatic Semiconductor’s ultra-thin, physically flexible, low-carbon chip for near-field communication.

Powered by Pragmatic’s unique FlexIC (flexible integrated circuit) technology, NFC Connect delivers industry-standard NFC endpoint capability in an ultra-thin, flexible form factor with a uniquely low carbon footprint. Inlay manufacturers, label convertors and service bureaus can now empower brands to effortlessly integrate NFC functionality into products or packaging – even on curved surfaces – delivering smarter, more connected experiences and deeper levels of consumer engagement at scale.

NFC Connect is manufactured at Pragmatic Park, Co. Durham – the company’s production facility and home of the UK’s first 300mm semiconductor fabrication line – which provides capacity to produce billions of chips per year using its innovative fabrication process. This sustainably delivers rapid cycle times and cost efficiencies, consuming less energy and water, and fewer harmful chemicals, than standard semiconductor manufacturing, while significantly driving down the environmental impact of production. 


Initial volume samples of the first member of the NFC Connect product line, PR1301, are available as frame-mounted 300 mm wafers, singulated dies, and sample inlays.

For more information, visit pragmaticsemi.com.