New Version of ODB++ for PCB Manufacturing

Updated data exchange format enables sharing as electronic data to improve NPI efficiency.

Mentor Graphics, a developer of electronic design automation software, announced the newest version of their ODB++ CAD-to-CAM data exchange format, a single and open data structure for transferring printed circuit board (PCB) designs into data for fabrication, assembly and test.


ODB++ is supported by all computer-aided manufacturing (CAM) systems sold over the past decade. The new version 8.1 of the ODB++ product model format provides a virtual documentation capability that translates all data files, drawings and documents from PCB design through the manufacturing flow.

This open product model format eliminates the need to create and validate disparate documentation content by supporting all electronic design automation (EDA) tool flows.

According to Mentor Graphics, users of the new ODB++ version will be able to share all the necessary manufacturing instructions as electronic data, which will make new product introduction (NPI) more efficient for all partners in the supply chain.

The idea behind virtual documentation of content is to replace a disparate set of drawings, documents and instructions with data elements that allow the recipient tool to automate the planning and execution of the manufacturing process preparation actions. 

An example would be to define the solder mask finish color within the ODB++ product model so that a PCB fabricator can automatically generate the process, material and routing instructions for that individual factory.

The ODB++ product model also includes support for EDA-based design net connectivity shorts. In many designs, one or more nets are intentionally shorted into a single net. The ODB++ product model now carries that net attribute, so that all downstream processes can be streamlined and automated.

The lack of such net characterization previously has been a limitation of existing data formats, resulting in wasted effort between design and manufacturing.

Additionally, content for rigid-flex buildup zones to define regions within the basic stack-up (either unique or within the same region) on the board can be carried forward into analysis and in the actual material-based stack-up definition.

This feature delivers accurate impedance calculations, using tools such as Frontline InStack. By accurately identifying the physical boundary of different stack-up areas for a rigid-flex circuit, the correct DFM rules can be applied automatically, and rigid-flex circuit manufacturers can easily and accurately calculate the impedance values for the circuit using their choice of materials.

A new format known as the IPC-2581 standard has emerged for organizing and conveying PCB designs from CAD tools to CAM systems for fabrication and assembly. Mentor is extending its support to the IPC-2581 Consortium and accompanying format standardization efforts.

“Mentor is the market leader for PCB design software and provides a best-in-class solution for NPI. With our latest ODB++ intelligent product model format, we now offer customers a complete and open design-through-manufacturing ecosystem,” said A.J. Incorvaia, vice president and general manager of Mentor Graphics Board Systems Division.

“Our mission is to provide our customers with the best tools and technologies to increase overall product quality and productivity,” Incorvaia continued. “This includes support for ODB++ and IPC-2581, giving our customers a choice in data exchange formats for hand-off to manufacturing.”

Additional information about the ODB++ product model format can be found here.