PostProcess Technologies announced a new way to remove SLA resin as a part of its offering of automated and intelligent additive manufacturing (AM) post-print technologies.
Building on its existing portfolio of SLA resin removal technologies with an enhanced chemistry formulation, the PostProcess solution completely removes resin on 3D printed SLA parts in 5 to 10 minutes. According to PostProcess Technologies, “the system offers unmatched results in cleaning up to 5 times as many parts before detergent saturation versus traditional solvent resin removal.”
The system was validated in multiple production environments with 8 different resin materials. As a part of PostProcess’ comprehensive hardware, software, and chemistry approach, the solution uses patent-pending SVC (Submersed Vortex Cavitation) technology in the DEMI and CENTI machines and proprietary AUTOMAT3D software. Software automation enables hands-free cleaning, precision control of parameters, advanced process monitoring, and proactive maintenance management.
The longevity of the PostProcess chemistry created for this solution, PG1.2, provides resin removal on up to 1000 trays* in the DEMI machine before reaching saturation. This longevity reduces the costs of waste disposal and machine down time as fewer detergent change outs are required. The PG1.2 chemistry also addresses health and safety concerns compared with traditional solvent solutions, offering a lower vapor pressure and higher flash point.
The SLA Resin Removal technology will be on display at the AMUG (Additive Manufacturing Users Group) Conference in Chicago, March 31 through April 4th, in PostProcess booth P21.
PostProcess Technologies
www.postprocess.com
*Average tray size = 15″
