Engineering.com roundup of recent simulation news.
Simcenter Star-Ccm+ 2402 Released
Simens Digital Industries Software has announced the release of Simcenter Star-Ccm+ 2402. The update to the CFD software focuses on speeding up results via more GPU options. The release also offers more accurate simulations for turbomachinery and coupled fluid-structure interactions. Now, engineers can also perform volumetric photon Monte Carlo simulations to model and assess the absorption and scattering of radiation as it interacts with media.
Modelon releases a new library for advanced automotive simulations
Modelon has released a new library to help engineers model and simulate battery thermal management and climate control systems on EVs. Some systems the library will help model include heat pumps and refrigerant-coolant systems. The library will help engineer size components such as electric motors, battery packs, cables and more based on operational and systems requirements.
Modelon has also expanded its libraries for driver-in-the-loop capabilities. Notable to this expansion is the ability to couple with simulation environments like rFpro.
Intel 18A processor technology now supported by Ansys and Siemens
Ansys and Siemens have announced that their design technology can now support Intel 18A process technology with RibbonFET transistors and backside power delivery.
For Siemens users, this means that the Calibre nmPlatform tool for integrated circuit (IC) design verification and the Analog FastSPICE (AFS) platform for analog, radio frequency, custom digital and mixed-signal circuit verification can now be used to design Intel 18A and 16 process technologies.
For Ansys users, they can assess the Intel 18A processor technology using RedHawk-SC and Totem for power integrity signoff of digital and analog designs. Users can also use PathFinder for electrostatic discharge and Raptor for high-speed signals including on-chip electromagnetic coupling.
Intel Foundry works with Ansys and Siemens on EMIB 2.5D technology
Like above, both Ansys and Siemens are now able to perform signoff, and other functions, for Intel’s embedded multi-die interconnected bridge (EMIB) 2.5D chip assembly technology. For instance, engineers can use Ansys RedHawk-SC Electrothermal to perform multiphysics thermal analyses on this IC technology. Meanwhile, users of Siemens Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlync software and Calibre nmPlatform can use these tools for EMIB floor planning, prototyping, signoff and more.
