New software improves data interoperability, data-center efficiency and PCB analysis’s roundup of recent simulation news.

Ansys and Nvidia to develop AI-powered simulation technologies

Ansys and chipmaker Nvidia announced a collaboration to develop next-generation solutions using accelerated computing and generative artificial intelligence (AI). They aim to integrate Nvidia Omniverse into more Ansys products, leverage high-performance computing to shorten design cycles, boost 6G technology development and incorporate AI techniques to enhance simulation. Ansys recently joined the Alliance for OpenUSD, an organization that promotes 3D-content standards, to support data interoperability across its products and help accelerate design and software performance. The company is also considering adopting Nvidia’s AI foundry for large language model (LLM) development to make simulation software more accessible.

Ansys Perceive EM in Nvidia Omniverse models 5G/6G antenna signals of moving vehicles in Denver. (Image: Ansys)

Ansys Perceive EM in Nvidia Omniverse models 5G/6G antenna signals of moving vehicles in Denver. (Image: Ansys)

Cadence’s new Reality Digital Twin Platform improves data center energy efficiency

According to the International Energy Agency, data centers consumed 4% of U.S. electricity in 2022 and are expected to increase usage for decades. The new Cadence Reality Digital Twin Platform uses AI and physics-based simulation to help data-center designers and operators improve energy efficiency by optimizing computing and cooling resources. The software models environmental conditions, such as airflow, wind speed, air intake, and temperature changes, that impact data-center design decisions. It also evaluates the energy-consumption impacts of cooling systems, design scenarios and operational strategies.

Altair to release SimSolid for electronics

Altair introduced an electronics-focused version of its SimSolid simulation software, which it expects to release in the second quarter of 2024. The inaugural product will perform structural and thermal analysis of printed circuit boards (PCBs) and integrated circuits (ICs). Altair said a future iteration will help engineers assess signal integrity, power integrity, and electromagnetic compatibility and interference. The aim is to keep pace with the complexities and miniaturization of electronics while making electromagnetic simulations more economical.