Organization receives over 400 abstracts for upcoming conference
The International Association for the Engineering Analysis Community (NAFEMS) has broken a record for their 2015 World Congress (June 21-24 in San Diego, CA). With over 400 submitted abstracts there is more than enough material to make this the best congress to date.
The World Congress is a biennial event where CAE practitioners, developers and industry analysts discuss simulation business, technology, trends, themes and roadmaps in an open forum. This will allow engineers to better plan for the future and ensure they can make the most out of their CAE technology.
Attendees will also be able to participate in the International Conference on Simulation Process and Data Management, which runs at the same time as the Congress.
David Quinn, Chief Marketing Officer at NAFEMS said, “It is vital that NAFEMS continues to explore all aspects of CAE, including up and coming hot topics … The World Congress will provide an independent view of a multitude of technologies and methods, with input from some of the leading industrial and academic minds.”
The globally sourced pool of submissions spans various industries, simulation technologies and SPDM. Some of these topics include:
- 3D Printing
- CFD
- Systems Engineering
- Composites
- Reliability & Robustness
- Coupling
- Multi-scale Analysis
- Adaptive Meshing
- Automated Meshing
NAFEMS CEO Tim Morris said, “We are delighted that the simulation community has engaged with the NAFEMS World Congress 2015 in the way they have so far … To have over 400 high-quality abstracts submitted for the event demonstrates that the engineering analysis society is eager to share experiences and develop their knowledge through presenting at and attending the 2015 Congress.”
For a taste of the types of presentations that will be held at the World Congress, watch this webinar.
Source NAFEMS
