Maxtek Adds Rapid Prototyping Services

BEAVERTON, OR – Maxtek Components Corporation announced the introduction of Rapid Prototyping Services. The new services, a result of industry and voice-of-customer research, are designed to support the need for faster validation of IC and package designs and speed the transition to full production.

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For equipment manufacturers in the defense, measurement, medical and communications industries, custom integrated circuits are a frequent and critical
part of their next-generation products just as timely delivery for these systems is
vital to remaining competitive. With this growing time-to-market pressure, being
able to reduce the time it takes to validate IC and package designs and move into
the prototype phase of a project is increasingly valuable to system manufacturers
and their development programs.

Maxtek’s Rapid Prototyping Services were specifically developed to address this
need for prototype speed, offering customers a path to rapidly validate their ASIC
designs by providing access to advanced interconnect capabilities and a low-cost
means of identifying issues—all of which is intended to reduce the design-to -prototype timeline. Additionally, and unlike dedicated prototype facilities, Maxtek provides customers with access to a highly-experienced engineering team as well as a complete manufacturing line capable of supporting full-rate production of low volume (1k to 100k parts per year) for high-performance or high-reliability IC packages and modules.

Three Levels of Rapid Prototyping Services

In evaluating the varying requirements of customers within the medical,
communications, defense and measurement markets, Maxtek identified three
services levels for rapid prototyping—BGA Build-to-Print, Advanced Build-to-Print
and Process Evaluation Build—primarily based upon device complexity and the
associated resource requirements and lead-time.

Entry-level prototyping (i.e., the least complex) is offered via Maxtek’s BGA Build-to- Print service, assembling JEDEC-standard Ball Grid Arrays in as little as three business days. For more complex packaging needs that may require additional production time, Maxtek created the Advanced Build-to-Print and Process
Evaluation Build service levels to provide additional solutions and flexibility for
custom requirements.

Maxtek Components Corporation

www.maxtek.com

MPF