IronCAD, of Atlanta, has upgraded its Multiphysics for IronCAD (MPIC) 2019, the company’s integrated FEA simulation tool. In December, IronCAD released its IronCAD Design Collaboration Suite 2019.
The majority of IronCAD customers are involved with the design and manufacturing of large, complex machines with many thousands of parts, factory automation layouts, and other assembly layout processes, according to an IronCAD statement.
Engineers that work with extremely large data sets use IronCAD design software because 3D models made in IronCAD only require one file, regardless of how complex the model is. Assembly part data is integrated into a file’s unified design environment rather than linking to external files. Feature, part, and assembly data can be stored in catalogs that can be pre-built to include frequently used parts and assemblies, allowing designers to extend the use of 3D data throughout the enterprise.
The suite is a range of CAD products that provides collaboration between 3D and 2D to optimize the engineering team’s design process and simplify 3D and 2D CAD data management and communication throughout its organization and with outside customers and suppliers.
Included is the IronCAD design product with integrated 3D and 2D design capabilities that allows users to choose from parametric, direct, or a combination of both modalities on demand in a single environment. Also included is the a 3D design and collaboration product, the 2D detailing and 3D collaboration product, and a product for 3D configuration and collaboration.
The 2019 release extends the CAD system’s Shrinkwrap capability to simplify imported and native models and gave users the ability to load the simplified or full versions of their models. Using the simplified version allows designers to focus on the design tasks and limit the performance impact of unrelated areas.
Typically, a design team receives files from their partners. By using the Shrinkwrap tools on imported data to remove unnecessary geometry, engineers can reduce the overall design file size and improve graphical and process performance during operations such as during saving and loading.
Users can also employ the Shrinkwrap tools to hide selective parts, non-visible parts, and hole and pocket regions while forcing critical components to remain. This is essential for sharing downstream when companies need to protect intellectual property while offering a reasonable-size model for sharing.
Originally introduced in 2014, MPIC provides fully coupled multiphysics with stress, thermal, and electrostatic analysis.
With the tool, users at any skill level can use full FEA capabilities by adding material, forces or constraints. The AutoSolve meshes and returns analysis results. Any modifications to the model allows for an analysis re-solve in seconds.
The solution is powered by software from AMPS Technologies.
“We designed MPIC to deliver a video game-like experience to analysis but behind the scenes, the advanced and robust AMPS technology provides a true what-if analysis tool for designers who need to pre-check, concept-proof, and experiment with different design scenarios,” says Chuck Paulsen, business director of AMPS Technologies.
MPIC 2019 brings several new technologies designed specifically for CAD assembly analysis. The new rigid body kinematic capability can speed analysis by mixing rigid body and finite element technologies. Critical parts continue to be analyzed using Sefea multi-physics while non-crucial parts or connecting mechanism are treated as rigid bodies to transmit the constraints, loads, or motion needed for an integrated assembly analysis.
In addition, new additions to MPIC include review features (comprised of new contour coloring controls and more extensive result displays), enhanced stabilization processes and improved contact-pressure predictions.
