Partnership between electronics 3D printer manufacturer and service provider aims to reduce development time from concept to production.
Aerosol printing technology manufacturer Integrated Deposition Solutions (IDS) and 3D-printed electronics services company, Advanced Printed Electronic Solutions (APES) have announced a new partnership. The aim is to accelerate customer development of next generation 3D printed electronics applications. The companies expect to improve alignment of customer product development design requirements with manufacturing and process technologies.
According to the two companies, the partnership addresses a significant business issue impeding adoption of printed electronics: customer time to market for innovative new products. The companies claim that customers often struggle with developing products incorporating 3D printed electronics. More specifically, they cite a lack of understanding for the capabilities of 3D printed electronics as limiting potential innovation and product differentiation.
IDS and APES will begin addressing these issues by creating a template-driven set of print processes with an end-to-end concept-to-production methodology. IDS will focus on providing aerosol-based printed electronic platforms and modules, as well as robust process recipes. APES will work with customers that are new to 3D-printed electronics, including supporting product concept definition and engineering development, as well as prototyping-to-pilot fabrication. This approach will be based on the foundation established by IDS in conjunction with APES’ in-house Neotech AMT 5-axis motion systems equipped with IDS NanoJet capability.
“A strategic partnership with Advanced Printed Electronics Solutions is a tremendous opportunity to aid NanoJet users as they move their project from concept to reality,” said Dov Phillips, Sales Manager for IDS in a joint press release. “Success in printed electronics relies on a viable application, well suited materials, and a reliable printer. There is a lot of momentum and excitement around aerosol printing for advanced electronics packaging, biomedical, optical, and flexible hybrid electronics applications. Having a partner like APES who will work closely with clients to hone in on these use-cases is a really great resource we can now offer our customers.”
“By bridging the gap that exists today between product engineering teams and 3D printed electronics fabrication technologies, not to mention the significant expertise required across each,” added Rich Neill, CEO and founder of APES. “I believe we can accelerate customer product development and accelerate the process required from R&D to pilot manufacturing, followed by scaling as needed for production.”
