EW – Production Edition – SCREEN Wet Station, EVG Laser Debonding & More

New products from Advantest, EV Group, Manncorp, SCREEN and Vi Technology.

Advantest Pick-and-Place IC Handler

(Image courtesy of Advantest.)

(Image courtesy of Advantest.)

Advantest has introduced the M4872 pick-and-place handler, which is designed to improve productivity in testing system-on-chip (SoC) devices in high-volume manufacturing (HVM) and device characterization pre-production environments.

The M4872 incorporates a common change kit, which helps to safeguard devices under test from potentially damaging packages. In total, the time it takes to change device types is reduced by more than 45 percent. In addition, the handler’s optional active thermal control unit employs efficient heating/cooling to maintain set point temperatures within 1C over a range of -45C to 125 C.

Advantest’s vision-alignment technology allows devices under test to be precisely positioned, making the handler ideally suited for testing fine-pitch ICs and devices with both top and bottom-side contacts. The resulting improvements in test yields and cycle times contribute to better overall productivity.

For more information, visit Advantest’s website.

EVG Laser Debonding for Fan-out Wafer-Level Packaging

(Image courtesy of EV Group.)

(Image courtesy of EV Group.)

EV Group (EVG) has unveiled its laser debonding module, which enables high-throughput, low-cost-of-ownership room-temperature debonding for thin and stacked fan-out packages.

Designed as a module for integration in the company’s EVG 850 DB automated debonding system, the laser debonding module incorporates a solid-state laser and beam-shaping optics to enable force-free debonding. Featuring both low-temperature debonding and high-temperature-processing stability, EVG’s laser debonding solution is ideal not only for fan-out wafer-level packaging, but also for processing compound semiconductors and power devices.

The module utilizes a solid-state UV laser and an optical setup that shapes the Gaussian beam profile of the laser into a “quasi top hat” beam profile. The setup achieves a reproducible beam with minimal heat introduced to the device wafer and flexible spatial control.

For more information, visit EVG’s website.

Manncorp LED Pick and Place System

(Image courtesy of Manncorp.)

(Image courtesy of Manncorp.)

Manncorp has released the MC-LEDV4 pick and place system. The MC-LEDV4 is designed specifically for high-speed assembly of long LED panels. Four vacuum pick and place heads, each with its own camera for component alignment, are mounted to a precise and ball-screw driven X-axis gantry. Positioning of the LED panel in the Y-axis is controlled by an indexing board holder.

The result is minimized head travel between feeders and placement locations, which allows placement rates of 15,000 CPH on panels up to 300 mm maximum width, completely independent of their overall length. Three different models are available for panels of 600, 1200, or 1800 mm maximum length, all of which can be ordered in configurations for inline automation or manual loading and unloading.

Information concerning pricing and availability is located on Manncorp’s website.

SCREEN Compact Wet Station

(Image courtesy of SCREEN.)

(Image courtesy of SCREEN.)

SCREEN has finalized development of its CW-2000 compact wet station. The system halves the footprint of its predecessor (the CW-1500) while increasing productivity by up to 150%. The CW-2000 integrates the system’s chemical supply and cooling units into the main body. These units previously had to be installed as accessory devices in a sub-area at each semiconductor production facility, but integrating them into the CW-2000 body has provided space savings of almost 50%.

SCREEN has also upgraded the CW-2000’s transfer system, allowing it to clean up to 150 wafers per hour as a standard specification. This volume can be boosted to 300 wafers per hour with the optional half-pitch specification. In addition, facilities can select the number of processing baths used in the CW-2000 according to their specific goals and applications.

Additional technical specifications are available on SCREEN’s website.

Vi Combines 3D Inspection with SIGMA Link for Smart Factories

(Image courtesy of Vi Technology.)

(Image courtesy of Vi Technology.)

Vi Technology will display its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link for Smart Factories at this year’s SMTA International, scheduled to take place September 19th and 20th. SIGMA Link, combined with two systems from the PI Series (3D SPI) and K Series3D (3D AOI), constitute one integrated product for automated optical inspection, with a live link between systems and a smart interface to improve SMT processes and productivity.

SIGMA Link is the element for Smart Factories to sort all inspection data and transform them into useful information for users. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yields to increased levels. 5K3D is a 3D AOI based on laser technology with angled cameras attached to the 2D Spectro optical package. The PI Series 3D SPI also provides accurate software for small pads.

For more information, visit Vi Technology’s website.

Missed the last EW – Production Edition? Click here.