EW – Production Edition – EVG Nanoimprint Lithography, Yamaha Modular Mounter & More

New products from Applied Materials, EVG, Hubbell Control Solutions, Nordson and Yamaha.

AM e-Beam Metrology for Layer-to-Layer Overlay

(Image courtesy of Applied Materials.)

(Image courtesy of Applied Materials.)

Applied Materials (AM) has introduced an optical overlay system for 10nm high-volume manufacturing (HVM). As improving overlay control is crucial to yield learning in HVM fabs, the company investigated deploying an inline e-beam overlay metrology using a SEM (scanning electron microscope) as a reference metrology for inline optical overlay.

This research method incorporated high-resolution imaging, physical measurement and a center of gravity algorithm to achieve sub-nm precision to indirectly obtain true overlay. Using an accurate and non-destructive metrology technique called random located SEM overlay (RLSO) (that selectively samples regions across the field of interest to confirm actual overlay offset) was a core part of the study. These regions were measured with e-beam technology that is the only system with resolution high enough to generate overlay data from the devices.

For more information, visit AM’s website.

EVG Nanoimprint Lithography for 3D Optical Structures

(Image courtesy of EVG.)

(Image courtesy of EVG.)

EVG and SwissLitho AG have announced a joint venture to enable the production of 3D structures down to the single-nanometer scale. The solution involves SwissLitho’s NanoFrazor thermal scanning probe lithography system to produce master templates with 3D structures for nanoimprint lithography (NIL), and EVG’s HERCULES NIL system with SmartNIL technology to replicate those structures at high throughput.

Thermal scanning probe lithography, the technology behind NanoFrazor, was invented at IBM Research in Zurich and acquired by SwissLitho AG. This maskless, direct-write lithography approach involves spin-coating a thermally sensitive resist onto the sample surface before patterning. A heated tip is then used to decompose and evaporate the resist locally while simultaneously inspecting the written nanostructures. The resulting arbitrary resist pattern can then be transferred into almost any other material using lift-off, etching, plating, molding or other methodologies. The target markets for this venture include photonics, data communications and augmented/virtual reality.

Additional technical specifications can be found on EVG’s website.

Hubbell Control Solutions Expands Lighting Control Platform

(Image courtesy of Hubbell Control Solutions.)

(Image courtesy of Hubbell Control Solutions.)

Hubbell Control Solutions has expanded its distributed lighting control platform for commercial and industrial facilities, NX Distributed Intelligence, with a focus on adding wired and wireless luminaire-based control options.

The Distributed Network Architecture (“DNA”) of NX aims to eliminate common operational dependencies on software, gateways and servers found in other lighting control systems by distributing control logic to each lighting control device.

NX is available as a wired and wireless solution, a standalone luminaire-based control, a small room network or a building-wide system across indoor and outdoor commercial, architectural and industrial spaces.  NX connects intelligent devices, such as luminaires, room controllers, panels, occupancy sensors, photocells, wall switches, relays and dimmers.

Applications include occupancy and vacancy, scheduling, daylight harvesting, 0-10V dimming, color temperature control, task tuning and occupant control.

Details on the complete set of controls for fixtures, rooms, buildings and all other lighting applications can be accessed on the Hubbell Control Solutions website.

Nordson Enhancing Performance of PCBAs Using Plasma Treatment

(Image courtesy of Nordson.)

(Image courtesy of Nordson.)

Nordson has released a research paper, entitled “Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment,” which discusses the fundamentals of plasma treatment. The core components of the research will be presented at SMTA Guadalajara 2017. One of the benefits of plasma processing for printed circuit board assemblies (PCBAs) is managing electrostatic discharge (ESD) damage.

Optimized plasma processes enable 3D-packaging technologies that are useful and reliable. Plasma treatment cleans surfaces prior to bonding to enhance adhesive bonding and wire bonds and enhances the flow of underfill materials for flip chip packages, providing better bonding and more reliable packages. It is beneficial prior to conformal coating for improved adhesion and flow characteristics. Plasma deposition of hydrophobic films onto PCBAs have been shown to improve long-term stability, and can be an alternative to conformal coatings.

For more information, visit Nordson’s website.

Yamaha Modular Mounter with Overdrive System

(Image courtesy of Yamaha.)

(Image courtesy of Yamaha.)

Yamaha has released the Sigma Series G5S Modular Mounter, which provides high-speed, flexible placement using a two-head mounting solution using the company’s Overdrive Control functionality. Self-loading “splice-less” SL feeders are designed to eliminate production interruptions, and quick-change feeder bases and tray units allow for increased productivity.

The Overdrive Control system enables the rotary heads to assemble PCBs simultaneously with no wait time and allows both placement heads to pick from each other’s component supply, on either side of the machine, and place them on the same board simultaneously and without restriction. Overdrive functionality lets users adapt to varying production requirements without reconfiguring the line.

Information concerning pricing and availability can be found on Yamaha’s website.

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