EW – Assembly Edition – Littlefuse Diode Arrays, Masterbond High Temperature Epoxy & More

New products from Alpha, ARCTIC, Dymax, Littlefuse and Masterbond.

Alpha Zero-Halogen Solder Paste

(Image courtesy of Alpha Assembly Solutions.)

(Image courtesy of Alpha Assembly Solutions.)

Alpha has introduced OM-347, a no-clean, lead-free, zero-halogen solder paste material that can print and reflow Type 4 and Type 5 powder for manufacturers requiring ultra-fine feature applications. OM-347’s Wide Reflow Profile Window enables soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170°C to 180°C. It can be reflowed in both air and N2.

“[OM-347] has a reflow process window that delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and shows random solder ball and mid-chip solder ball resistance,” said Traian Cucu, global product manager for solder paste at Alpha Assembly Solutions.

For more information, visit Alpha’s website.

ARCTIC Compatibility with Intel Core-X Processors

(Image courtesy of ARCTIC.)

(Image courtesy of ARCTIC.)

ARCTIC has released a variety of compatible CPU coolers for Core-X processors. The Freezers of the series 11, 12, 32 and 33 can all be used without any adjustment on the new Intel platform. The same applies to the Liquid Freezer 120, Liquid Freezer 240 and Liquid Freezer 360, the Allin-One CPU Water Coolers are equally compatible for the Intel processors.

The processors achieve a thermal design power (TDP) of up to 112 W. Both the tower CPU coolers as well as the water coolers from ARCTIC are designed to offer heat dissipation and cooling performance at a low noise level.

For more information, visit Intel’s website.

Dymax LED-Curable Adhesive for Plastics and Metals

(Image courtesy of Dymax.)

(Image courtesy of Dymax.)

Dymax has introduced 1406-M, a needle bonding adhesive for manufacturers looking to switch to LED curing in small gauge needle and other plastic and metal applications. Dymax 1406-M needle bonding adhesive is designed to be cured with either 385 nm or 406 nm UV wavelength light source for fast bonding of multiple substrates typically used in the manufacturing of needle assemblies and syringes or other medical devices. This product fluoresces blue of in-line inspection under low-intensity black light (365 nm). Bondable substrates include stainless steel, PP, PE, ABS, PC, PEI, PETG, PMMA, PS and PVC.

In addition, 1406-M provides bonding performance on the reduced surface area of smaller cannulas, even after aging and sterilization, to reduce the possibility of cannula substrate failure. Optimized for 385nm LED curing, 1406-M allows for tighter standard deviations and enables small gauge needle manufacturers to enjoy the benefits of LED curing without sacrificing speed or cured mechanical properties.

Additional technical specifications are available on Dymax’s website.

Littlefuse TVS Diode Arrays

(Image courtesy of Littlefuse.)

(Image courtesy of Littlefuse.)

Littlefuse has introduced a series of 0.9pF ±30kV Discrete Unidirectional TVS Diode Arrays (SPA Diodes). SP3222 Series TVS Diode Arrays are designed with low capacitance rail-to-rail diodes and an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharge (ESD). These diodes are AEC-Q101 qualified and can safely absorb repetitive ESD strikes above the maximum level specified in international standards without performance degradation.

Low loading capacitance makes them ideal for providing ESD protection for high speed data lines such as MIPI Camera and Display, USB2.0, USB3.0 and eSATA. They are well-suited to protect the newest sensitive chipsets with geometries of 28nm and smaller from destructive ESD.

Information concerning pricing and availability can be found on Littlefuse’s website.

Masterbond High Temperature Resistant Epoxy

(Image courtesy of Masterbond.)

(Image courtesy of Masterbond.)

Masterbond has launched the EP13LTE, a one part epoxy for structural bonding applications. EP13LTE cures in 1-2 hours at 300-350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates such as metals, glass, composites, ceramics and plastics.

Once cured, EP13LTE has a strength profile delivering a tensile lap shear strength of 2,600-2,800 psi, a compressive strength of 24,000-26,000 psi and a tensile modulus of 500,000-550,000 psi. This dimensionally stable system is able to withstand 1,000 hours at 85°C/85% RH and maintain a Shore D hardness of 90.

With a volume resistivity exceeding 1015 ohm-cm, EP13LTE has reliable electrical insulation properties. This system also passes ASTM E595 testing for NASA low outgassing. It is serviceable over the wide temperature range of -51 C to +260 C. This tan colored system is available for use in syringes, jars, half pints and pint containers.

For more information, visit Masterbond’s website.

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