Electronics Weekly – Toshiba MOSFETs, KLA-Tencor Inspection Tech and More

The latest developments in electronic components, renewable energy and optimization testing.

Toshiba Introduces High-Voltage MOSFET Family

(Image courtesy of Toshiba.)

(Image courtesy of Toshiba.)

Toshiba America Electronic Components, Inc. announced a new lineup of MOSFETs for switching voltage regulator designs. Available with 800V and 900V ratings, the four N-channel devices (TK4A80E, TK5A80E, TK3A90E, TK5A90E) are targeted to applications that require current switching below 5.0A.

The MOSFETs are based on Toshiba’s Ï€-MOS VIII (Pi-MOS-8). This technology supports reduced gate charge and capacitance, without losing the benefits of low RDS(ON).

These MOSFETs represent low-current supplements to Toshiba’s existing DTMOS IV line-up of 800V superjunction DTMOS IV devices. The 2.5A TK3A90E and 4.5A TK5A90E feature VDSS ratings of 900V and have typical RDS(ON) ratings of 3.7Ω and 2.5Ω, respectively. Both the 4.0A TK4A80E and 5.0A TK5A80E devices offer VDSS ratings of 800V with typical RDS(ON) ratings of 2.8Ω and 1.9Ω, respectively.

Toshiba’s new high-voltage MOSFETs offer a maximum leakage current of 10μA (VDS = 640V for the 800V device; VDS = 720V for the 900V device) and a gate threshold voltage range of 2.5V to 4.0V. All of the devices are supplied in a standard TO-220SIS form factor.

(Image courtesy of Toshiba.)

(Image courtesy of Toshiba.)

Toshiba’s new high-voltage MOSFETs are available now.  

TRUMPF Hüttinger Taps into Electronics for Renewable Energies

Renewable energies will only unlock their full potential where storage technologies and extended power grids are available. A new type of battery might be the key, and the vital electronics are now being developed at TRUMPF Hüttinger.

Batteries are well suited to catch and level out peaks in energy generation from wind and sun, and store the energy for later use. Currently, even e-cars are considered a possible storage solution. Battery systems directly attached to wind and solar power plants provide much more efficient solutions that are just as suitable for local use as for grid feed.

A new type of storage, known as redox flow batteries, are just being introduced to the market. These batteries use liquid electrolytes as storage media, can be built for large scale storage capacities, and have a virtually infinite life-cycle. The downside: they take up a considerable amount of space.

Power inverters act as an interface between power generation, storage and withdrawal of electrical energy. Every photovoltaic system is equipped with a power inverter; however, readily available types are not entirely suitable for redox flow batteries. Being one of the pioneers in the field, TRUMPF Hüttinger has teamed up with the Fraunhofer Institute for Solar Energy Systems ISE to develop specially designed power inverters that are now at the prototype stage.

The renewable energy project market launch is scheduled for early 2017. Find out more at the company website.

BQR fiXtress Optimizes Schematic Testing in ADAS Systems

(Image courtesy of BQR.)

(Image courtesy of BQR.)

BQR recently announced that Mobileye autonomous driving technologies uses BQR fiXtress ASR (Automatic Schematic Review) for optimizing ADAS (Advanced Driver Assistance Systems) schematic testing.

FiXtress ASR serves as a Rule Based Verification System, detecting schematic design errors based on component parameters and rules. Typical engineering practices include a complex design review process, and fiXtress ASR automates this procedure, verifying proper implementation of the reference design as recommended by chip manufacturers. The fiXtress testing checks the inter-connection of chips according to a sequence of rules, such as the interconnection of a Mobileye ASIC to LPDDR4 memory chip.

FiXtress is integrated with Cadence Allegro and OrCAD, Mentor and Altium design tools. It uses the BOM and Netlist along with component libraries, enabling verification of the vehicle manufacturer’s design.

KLA-Tencor Announces New Suite of Reticle Inspection Technologies

The LMS IPRO6 mask registration metrology tool. (Image courtesy of KLA-Tencor.)

The LMS IPRO6 mask registration metrology tool. (Image courtesy of KLA-Tencor.)

KLA-Tencor Corporation has introduced three reticle inspection systems that address 10nm and below mask technologies: the Teron 640, Teron SL655 and Reticle Decision Center (RDC). All three systems are key to enabling both current and next-generation mask designs, so that mask shops and IC fabs can more efficiently identify lithographically significant and severe yield-damaging defects.

The Teron 640 supports inspection of optical masks through utilization of 193nm illumination with Dual Imaging mode—a combination of high resolution inspection and aerial imaging with printability-based defect dispositioning. Additionally, the Teron 640 includes inspection algorithms to further maximize defect sensitivity.

The Teron SL655‘s core technology generates a reference from the mask at incoming quality check and then uses this reference for mask re-qualification inspections, and allows collaboration with IC manufacturers on in-fab EUV reticle inspection requirements. Teron SL655 systems are under evaluation with IC manufacturers for incoming reticle quality control and reticle re-qualification during chip production.

RDC is a comprehensive data analysis and storage platform that supports multiple KLA-Tencor reticle inspection and metrology platforms for mask shops and IC fabs. RDC provides several applications including Automatic Defect Classification (ADC) and Lithography Plane Review (LPR). These applications automate defect disposition decisions.

The Teron 640, Teron SL655 and RDC join the LMS IPRO6 reticle pattern placement metrology system and K-T Analyzer data analysis system, and the Teron 640, Teron SL655 and RDC are backed by KLA-Tencor’s global service network. More information can be found on the 5D Patterning Control Solution web page.

RS Components Announces IP67 Wire-to-wire and Wire-to-board Connectors for Harsh Environments

(Image courtesy of RS Components.)

(Image courtesy of RS Components.)

RS Components (RS), the trading brand of Electrocomponents plc, has extended its portfolio of connectivity solutions with the EDAC 572 and 560 series of IP67-rated connectors.

The 572 (5.8mm pitch) and 560 (2.5mm pitch) series connectors are available in wire-to-wire and wire-to-board options. They extend EDAC’s E-Seal IP67-rated connectors to include D-Sub, USB, HDMI, and support low-level signal and power requirements up to 300V at 10A with an operating temperature range of between -40 degree and +105 degree Celsius. They are highly resilient to vibration and available in a choice of four colour-coded sizes to accommodate wire diameters from 1.7 to 3.1mm.

For more information, visit the RS website.


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