New products from TI, CEVA, Expressif, Tektronix and Toshiba.
TI Wireless Connectivity Modules for Industry 4.0 and IoT
Texas Instruments (TI) has announced an expansion of its wireless connectivity module portfolio with the availability of SimpleLink Bluetooth low energy certified modules with integrated antennas.
TI also offers modules for products with Wi-Fi, dual-mode Bluetooth and Wi-Fi + Bluetooth combo connectivity.
TI’s wireless connectivity module-based development kits are available now on the TI Store and through TI distributors. For more information, watch TI’s training videos or check out the ConnecTIng Wirelessly blog.
TI USB Type-C and Power Delivery 3.0 Devices
Texas Instruments (TI) has also introduced five new USB Type-C and Power Delivery (PD) devices for design of USB Type-C electronics.
The TUSB1046 family of linear redrivers supports 10G USB data and DisplayPort 1.4 video transfer. The redrivers compensate channel loss up to 14.4 dB when transmitted over long traces and cables, and allow for 16 equalization levels.
The TPD8S300 and TPD6S300 devices protect against overvoltage damage and the port protectors integrate transient voltage suppression (TVS) diodes.
TI’s 10G linear redriver family is pin-to-pin compatible with TI’s family of 5G USB devices and comply with the new USB Type-C, USB 3.1 Gen 2 and PD 3.0 standards.
Toshiba e-MMC, UFS NAND Flash Memory Solutions
Toshiba America Electronic Components, Inc. (TAEC) has released an Embedded Multimedia Card (e–MMC) and Universal Flash Storage (UFS) embedded memory solution featuring integrated controller technologies.
E–MMC and UFS devices integrate NAND flash memory and a controller chip in a single package, including bad block management, error correction, wear leveling and garbage collection.
Toshiba’s e-MMC devices are available in capacities from 16GB to 128GB, with sequential read and write speeds of 320MB/sec and 180MB/sec.
While e–MMC reaches a theoretical limit with an 8bit parallel interface of 400MB/sec, UFS memory extends interface performance through high-speed differential signaling using a MIPI M-PHY interface. This results in theoretical performance of 1166MB/sec by supporting a 2-lane MIPI M-PHY HS-G3 interface.
The UFS devices are available in capacities from 32GB to 128GB, with sequential read and write speeds of 850MB/sec and 180MB/sec.
For more information on Toshiba’s flash memory solutions visit the company website or read the TAEC Memory Blog.
Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip
CEVA, Inc. recently announced a partnership with Espressif Systems for Internet of Things (IoT) applications. Under the partnership, Espressif has deployed RivieraWaves Bluetooth dual mode technology in its ESP32 chip.
Aimed at mobile devices, wearable electronics and the Internet of Things (IoT) applications, the ESP32 combo chip integrates wireless interfaces for 802.11b/g/n Wi-Fi and CEVA’s Bluetooth 4.2 dual mode, along with a GPIO offering.
CEVA’s RivieraWaves Bluetooth IP platforms consist of a hardware baseband controller, and a software protocol stack. A radio interface allows the platform to be deployed with either RivieraWaves RF or partners’ RF IP.
For more information on RivieraWaves Bluetooth IP platforms, visit the product website.
Tektronix Introduces Keithley S540 Power Semiconductor Test System
Tektronix has introduced the Keithley S540 Power Semiconductor Test System, a 48 pin parametric test system for wafer-level testing of power semiconductor devices and structures up to 3kV.
The S540 can perform parametric measurements on up to 48 pins without changing cables or probe card infrastructure. It can also perform transistor capacitance measurements such as Ciss, Coss, and Crss up to 3kV, again without manual reconfiguration of test pins. The S540 offers sub-pA measurement performance and can perform fully automated, high voltage leakage current tests in <1 sec.
The Keithley S540 is available for order now with delivery beginning in March, 2017.
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