Electronics Weekly – ADLINK Smart Panel, Microchip Audio SoC & More

New products from ADLINK, Maxim, Microchip, Microsemi and RS Components.

ADLINK Smart Panel

Smart Panel. (Image courtesy of ADLINK.)

Smart Panel. (Image courtesy of ADLINK.)

ADLINK has introduced its Smart Panel (SP). This all-in-one open frame panel PC provides flexible configuration options with an increased level of modularization. Coupled with ADLINK’s Function Module (FM) design, the SP speeds prototyping based on application requirements with reduced time, effort and cost.

The SP offers choices of 7-inch to 21.5-inch 16:9 displays; P-CAP or resistive touch panels; mainboards powered by Intel Atom x5-E3930/x7-E3950 processors; support for Windows 10, Linux and Android operating systems; and various built-in I/O interfaces.

For more information, visit ADLINK’s website.

Maxim Secure Microcontroller

MAX32558 microcontroller. (Image courtesy of Maxim.)

MAX32558 microcontroller. (Image courtesy of Maxim.)

Maxim released the MAX32558 microcontroller. Suited for manufacturers of security-sensitive industrial, consumer, computing and internet of things (IoT) devices, the MAX32558 lets users build in secure cryptographic operations, integrate key storage systems and enable active tamper detection.

As a member of the DeepCover family of secure microcontrollers, the MAX32558 provides enhanced security features while enabling designers to save up to 50 percent of printed circuit board (PCB) space compared to similar devices.

Additional technical specifications are available on Maxim’s website.

Microchip Bluetooth Audio SoC

IS2064GM-0L3 SoC. (Image courtesy of Microchip.)

IS2064GM-0L3 SoC. (Image courtesy of Microchip.)

Microchip launched the IS2064GM-0L3, a fully certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology. The SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio beyond audiophiles into mass-market Bluetooth wireless products.

The IS2064GM-0L3 SoC’s LDAC codec is also integrated into the Android 8.0 Oreo operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.

For more information, visit Microchip’s website.

Microsemi Gen 4 PCIe Switches

PCIe development chart. (Image courtesy of Microsemi.)

PCIe development chart. (Image courtesy of Microsemi.)

Microsemi announced its Switchtec Gen 4 PCIe switches, allowing users to build low latency interconnect systems in areas such as machine learning, data center servers and storage equipment.The Switchtec Gen 4 PCIe switches are GPU-optimized with low pin-to-pin latency and low latency variation for optimal machine learning workload performance.

Other features include up to 100 line-rate capable PCIe lanes as well as an integrated cut-through direct memory access (DMA) engine. Reliability features include hot and surprise-plug support, end-to-end data integrity and debugging with the ChipLink diagnostics tool.

Information concerning pricing and availability can be found on Microsemi’s website.

RS Components Motor Circuit Protection

TeSys GV4 range of motor circuit breakers. (Image courtesy of RS Components.)

TeSys GV4 range of motor circuit breakers. (Image courtesy of RS Components.)

RS Components unveiled the TeSys GV4 range of motor circuit breakers from Schneider Electric. Designed to ensure continuous operation and reduce motor downtime under harsh conditions, the TeSys GV4 combines basic circuit breaker protection with the ability to handle up to 55kW of power and current up to 115A.

The TeSys GV4 line offers three types of protection: magnetic for the GV4L model, electronic thermal magnetic for the GV4P—dual-class 10 and 20 with a range of overload settings—and electronic thermal magnetic with adjustable advanced protection and alarming features for the GV4PEM.

For more information, visit RS Components’ website.

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