Plus the latest simulation news from Ansys and Eon Reality in this Engineering.com roundup.
Comsol releases Multiphysics v6.3
Comsol announced the latest release of its simulation software, Comsol Multiphysics v6.3. The updated software includes new capabilities and performance enhancements for electromagnetics, structural mechanics, acoustics, fluid and heat, and chemical and electromechanical simulations, as well as new geometry tools and general updates.
One notable addition to Comsol Multiphysics v6.3 is the new Electric Discharge Module, which can analyze electric discharges and breakdowns in solids, liquids and gases.
Another release highlight is that Comsol Multiphysics’ Acoustics Module now supports GPU acceleration, which Comsol says will enable time-domain simulations of pressure acoustics to run up to 25 times faster. “The new GPU support for transient acoustic simulations is invaluable for engineers working on automotive sound systems or optimizing acoustics in office and residential spaces,” said Mads J. Herring Jensen, development manager at Comsol, in the company’s press release.
Comsol Multiphysics v6.3 also adds new automated geometry preparation tools that will detect and remove small details and gaps in CAD models, which Comsol says will enable robust mesh generation to streamline model development.
Ansys integrates Nvidia Modulus AI into semiconductor simulation suite
Ansys announced that its semiconductor simulation products will integrate Nvidia Modulus, a physics-based framework for training and deploying AI models. According to Ansys, the integration will allow engineers to develop customized generative AI surrogate models to help them explore a larger design space for products including GPUs, HPC chips and other integrated circuits.
Ansys says it plans to integrate Modulus-created AI accelerators in RedHawk-SC, Totem-SC, PathFinder-SC and RedHawk-SC Electrothermal. The company claims in its press release that it has demonstrated over a 100x speedup for thermal simulations using the AI-enhanced process.
“Nvidia Modulus makes it easy to train and deploy AI models that are physics-informed and reflect real-world causality,” said Tim Costa, senior director of CAE, EDA & quantum and HPC at Nvidia, in the Ansys press release. “The integration with Ansys simulation products for multiphysics semiconductor design are ideal applications for Modulus to enhance simulation speed and efficiently identify the best design solutions.”
In other Ansys news, the company has been awarded a contract with the Microelectronics Commons to provide its simulation software to the Department of Defense–backed network.
Eon Reality launches Procedural Skill Simulator
Eon Reality launched the Procedural Skill Simulator as part of its Knowledge Simulator platform, an AI-assisted augmented and virtual reality (AR/VR) training solution. The new simulator is designed to train professionals in manufacturing, aviation, healthcare and beyond, according to Eon Reality. The platform employs a three-phase learning approach that includes demonstration, practice and assessment.
“By combining AI-driven guidance with immersive visualization, we’ve created a learning environment that dramatically accelerates skill acquisition while ensuring absolute precision and safety compliance,” said Dan Lejerskar, chairman of Eon Reality, in the company’s press release.
