About Vincent Charbonneau
Vincent Charbonneau
Vincent Charbonneau contributes to engineering.com's Electronics and Manufacturing sections. He is a graduate of Carleton University's Communication and Media Studies program, and has fulfilled many writing roles over the last few years.

Entries for 'Vincent Charbonneau'

SnapEDA Launches the “Google Analytics” of Electronic Components
SnapInsights seeks to provide data for electronic component suppliers.
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Tektronix Updates Its Line of Digital Storage Oscilloscopes
The TBS2000B offers 200MHz bandwidth, 5M point record length and more.
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EVs Receive Boost with New Bi-Directional Converter
Calex’s BCA converter sees a 97% increase in efficiency over its predecessors.
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Medtronic Is Releasing Its Ventilator Design for Free
The move will help boost production of the much-needed ventilators for COVID-19 patients.
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Silicon Carbide Could Improve MOSFET Performance
ON Semiconductor claims that new SiC MOSFETs boost performance and reliability compared to silicon.
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Next-Gen mmWave Synthesizer Targets 5G
Renesas Electronics’ 8V97003 offers high frequency range and low phase noise.
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New Development Platform for Cellular IoT Devices
NXP and Sequans partner to offer platform for LTE-M and NB-IoT connectivity.
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New Power Modules Target BLDC Motor Drive Systems
The compact IPM7 series is designed for fan motor applications.
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Samsung Announces Turnkey System for Mobile Device Security
Secure Element chip helps smartphones and tablets guard sensitive data.
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New USB-C Controllers Aim to Improve Next-Gen PCs and Notebooks
Cypress has revealed new details and specifications for its upcoming USB-C controllers.
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Samsung Launches New 16GB High Bandwidth Memory 2E
Samsung’s Flashbolt memory targets supercomputer and AI applications.
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Schneider Electric Launches Upgraded Power Meter
The ION9000T includes new capabilities designed to protect against critical outages.
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SnapEDA Adds 20,000 Symbols to Its Online Component Library
SnapEDA now offers RECOM power electronics symbols and footprints for PCB design.
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New Transistor Design Aims to Surpass Moore’s Law
A new design for silicon integrated circuits has doubled the number of transistors per chip.
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3D Printing Complex Electronic Components Creates New Manufacturing Possibilities
3D printing electronic components opens a new realm of possibilities, but it's far from perfect.
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Worldwide Survey Highlights Growing Anticipation of Autonomous Vehicle Technology
ANSYS survey shows significant increase in anticipation of AVs.
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Electronics Weekly –TT Reflective Optical Sensor, Vision High Speed Camera and More
New products from Microchip, Microsemi, Texas Instruments, TT Electronics and Vision Research.
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EW – Testing Edition – AMETEK Point Level Probes, Hioki Electrode Resistance Measurement and More
New products from AMETEK, B&K Precision, Hioki, Pico and Tektronix.
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Electronics Weekly – Microchip Capacitive Touch Controllers, Renesas AI Processing and More
New products from Microchip, Microsemi, Renesas Electronics, SILVACO and TT Electronics.
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EW – Design Edition – Cadence Verification IP, SnapEDA Optoelectronic Design and More
New products from Cadence, Imagination Technologies, National Instrument, SILVACO and SnapEDA.
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