EW – Production Edition – Bruker Spectrometry Imaging, EVG Wafer Bonding & More
Vincent Charbonneau posted on June 26, 2019 |

ASM Line Monitor

Line Monitor. (Image courtesy of ASM Assembly Systems.)
Line Monitor. (Image courtesy of ASM Assembly Systems.)

ASM Assembly Systems has introduced its Line Monitor, designed to work in conjunction with the company’s E-Solutions Line. The Line Monitor does not only display the status of orders on the line, but minimizes errors and line stops by proactively coordinating the line staff. It also notifies the line staff of upcoming operations like, for example, which feeders need to be refilled soon. This proactive coordination makes manufacturing jobs smoother, minimizes line stops, and increases the total line output.

For more information, visit ASM’s website.

Bruker Spectrometry Imaging

timsTOFfleX mass spectrometer. (Image courtesy of Bruker.)
timsTOFfleX mass spectrometer. (Image courtesy of Bruker.)

Bruker has announced its timsTOFfleX mass spectrometer, which includes a software-switchable MALDI source adapted to the ESI timsTOF Pro platform. This combined ESI/MALDI capability provides spatially-resolved omics onto one instrument. The timsTOFfleX comes with the company’s 10 kHz SmartBeamTM 3D laser with true pixel fidelity for rapid, label-free MALDI imaging at high-spatial resolution, while preserving the 4D proteomics and phenomics sensitivity of the timsTOF Pro in ESI mode.

For more information, visit Bruker’s website.

CUI Terminal Block Connectors

TB00X terminal block connectors. (Image courtesy of CUI.)
TB00X terminal block connectors. (Image courtesy of CUI.)

CUI has launched a series of terminal block connectors. Featuring up to 24 pole counts, the terminal blocks are available in pluggable, screw type and screwless configurations with 2.54, 3.50, 3.81, 5.00, 5.08 and 7.62 mm pitches. The terminal blocks also offer horizontal, vertical, 45° and 180° orientations, making them suited for lighting systems, commercial building equipment, industrial controls and any wire-to-board applications requiring rapid wire termination in the field.

For more information, visit CUI’s website.

EVG Wafer Bonding

ComBond bonding platform. (Image courtesy of EVG.)
ComBond bonding platform. (Image courtesy of EVG.)

EVG has unveiled several wafer bonding systems at this year’s Electronic Components and Technology Conference. One such device is the ComBond automated high-vacuum bonding system, which provides oxide-free direct bonding of “anything on anything.”

In a joint paper by EVG and IHP, the companies describe the process of vacuum bonding as “a wafer-level aluminum-aluminum (Al-Al) thermo-compression bonding process used in combination with an optimized Al sputter-deposition process. Surface treatment and subsequent bonding are both performed in a high-vacuum cluster via the EVG ComBond.”

For more information, visit EVG’s website.

Nordson Compact Motorized Mixer

Steadi-Mix 2K motorized mixer. (Image courtesy of Nordson.)
Steadi-Mix 2K motorized mixer. (Image courtesy of Nordson.)

Nordson has developed its Steadi-Mix 2K, a compact motorized mixer for pressure-sensitive material mixing. The Steadi-Mix 2K can be utilized by material manufacturers and sealant users who make and package their own two-component materials. The device contains dual material dispense valves and steady motor control to increase production and provide reliable operation for aerospace, composite and light-weighting industries.

For more information, visit Nordson’s website.

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