Electronics Weekly – Maxim Amplifier, TI CAN FD Controller & More
Vincent Charbonneau posted on June 21, 2019 |

Arrow Electronics Engineering Services Marketplace

ArrowPlus marketplace. (Image courtesy of Arrow Electronics.)
ArrowPlus marketplace. (Image courtesy of Arrow Electronics.)

Arrow Electronics and Freelancer.com have joined forces to launch the ArrowPlus electronics and electrical engineering services marketplace. The platform allows companies—big and small—and technology creators to design and build hardware products through their access to over half a million skilled electronic and electrical engineers. The marketplace is designed to solve technology problems spanning markets such as consumer electronics, transportation, healthcare, industrial, and the Internet of Things (IoT).

For more information, visit Arrow’s website.

Maxim Amplifier for Miro Speakers

MAX98390 speakers. (Image courtesy of Maxim.)
MAX98390 speakers. (Image courtesy of Maxim.)

Maxim has developed its MAX98390 amplifier with integrated Dynamic Speaker Management (DSM) algorithm, which provides louder and richer sound at a low quiescent power. The boosted, digital Class D DSM amplifier helps to unleash a system’s audio potential by safely driving higher power levels (up to 5.1W) into tiny speakers that are typically rated for much lower power (between 1 to 3W).

For more information, visit Maxim’s website.

Microchip USB Smart Hub ICs

USB 2.0 Smart Hub IC family. (Image courtesy of Microchip.)
USB 2.0 Smart Hub IC family. (Image courtesy of Microchip.)

Microchip has added the USB4912 and the USB4712 to its USB 2.0 Smart Hub IC family.The chips allow automotive manufacturers to add a single port under the radio—in the center console or alongside wireless charging applications.

Each device includes an embedded 32-bit MCU for the implementation of USB I/O bridging. Both chips support USB 2.0 low speed, full speed and hi-speed with a single USB 2.0 hi-speed upstream port for host connection, while the USB4912—a low-power, configurable USB 2.0 hub controller—allows connectivity to be extended to GPIO, I2C, SPI and UART so that the USB Smart Hub becomes the central point for system connectivity and control.

For more information, visit Microchip’s website.

Microsemi Radiation-Tolerant FPGAs and SpaceFibre Technology

RTG4 development board. (Image courtesy of Microsemi.)
RTG4 development board. (Image courtesy of Microsemi.)

Microsemi has collaborated with STAR-Dundee to create an evaluation platform that implements SpaceFibre technology, which was recently recognized by the VITA Standards Organization as a control-and-data plane option for its SpaceVPX interconnect standard.

The STAR-Dundee 3U SpaceVPX demonstration board speeds the development of SpaceVPX (VITA-78)-compliant data networking systems for space applications. Featuring field-programmable gate arrays (FPGAs) that are immune to radiation-induced configuration changes, the development board uses Microsemi’s RTG4 chips to optimize performance while providing systems with an important added level of failure protection in space.

For more information, visit Microsemi’s website.

TI CAN FD Controller and Transceiver

TCAN4550-Q1 controller and transceiver. (Image courtesy of Texas Instruments.)
TCAN4550-Q1 controller and transceiver. (Image courtesy of Texas Instruments.)

Texas Instruments (TI) has introduced an automotive system basis chip that combines a controller and transceiver for Controller Area Network with Flexible Data-Rate (CAN FD). Designed to meet the needs of in-vehicle networks, the TCAN4550-Q1 uses the Serial Peripheral Interface (SPI) bus of almost any microcontroller to implement, with minimal hardware changes, a CAN FD interface or increase the amount of CAN FD bus ports in a system.

For more information, visit TI’s website.

Missed last week’s Electronics Weekly? Click here.


Recommended For You