EW – Assembly Edition – Heraeus DCB Substrates, SCHUNK Vice and More
Vincent Charbonneau posted on June 05, 2019 |

Heraeus DCB Substrates

DCB substrate. (Image courtesy of Heraeus Electronics.)
DCB substrate. (Image courtesy of Heraeus Electronics.)

Heraeus Electronics has launched its Condura line of Direct Copper Bonding (DCB) substrates. Modern power electronics are already based on long-lasting direct copper bonding substrates, but load limits and demands on the surface structure of the substrate materials continue to grow.

The Condura line addresses this challenge with an improved design, alongside a surface finish that extends the durability of the substrate. An additional service offered by the company is grinding process – a specialized mechanical surface treatment that provides optimized functionality properties.

For more information, visit Heraeus’ website.

Littelfuse MOSFETs

X-Class HiPerFET MOSFETs. (Image courtesy of Littelfuse.)
X-Class HiPerFET MOSFETs. (Image courtesy of Littelfuse.)

Littelfuse has unveiled its 1000V X-Class HiPerFET MOSFETs. The MOSFETs are suited for high-power density applications. These include resonant-mode power supplies, battery chargers and welding inverters. Each MOSFET can replace several parallel-connected higher on-resistance devices for simpler design, higher reliability and lower overall cost.

For more information, visit Littelfuse’s website.

LPKF Stencil Cutting

MicroCut6080 stencil. (Image courtesy of LPKF.)
MicroCut6080 stencil. (Image courtesy of LPKF.)

LPKF has introduced two systems designed for stencil cutting: the MicroCut 6080 enables apertures of 18 µm or 10 µm (laser entrance or exit side) with optimal roundness in a 30 µm SMT stencil board. Minimal radii make almost any cutting contour possible. In addition, up to 33000 apertures between 10 and 125 µm per hour ensure efficient production.

The other system is the PowerCut 6080, which is used for processing thick stainless steel sheets. It is also utilized to produce micro-cut parts from material up to 4 mm thick. Circular openings and extreme radii are easier to achieve. The result of the precise machining is smooth edges with low taper.

For more information, visit LPKF’s website.

Master Bond Epoxy Features Thermal Cycling Resistance

Supreme 17HT epoxy. (Image courtesy of Master Bond.)
Supreme 17HT epoxy. (Image courtesy of Master Bond.)

Master Bond has developed Supreme 17HT, a single component, no mix epoxy for bonding and sealing applications, and featuring an unlimited working life at room temperature. According to Rohit Ramnath, senior product engineer at Master Bond, “This thermally stable formulation has a high glass transition temperature of 410°F and retains its bond strength at elevated temperatures.”

Supreme 17HT also possesses high bond strength properties with lap shear strength of 1,900-2,100 psi and tensile strength of 7,000-8,000 psi. The epoxy is a reliable electrical insulator with volume resistivity of over 1015 ohm-cm at ambient temperatures and over 1012 ohm-cm at 400°F.

For more information, visit Master Bond’s website.

SCHUNK Vice

KONTEC KSC vice. (Image courtesy of SCHUNK.)
KONTEC KSC vice. (Image courtesy of SCHUNK.)

SCHUNK has released its KONTEC KSC series of vices. From conventional clamping, low clamping depths for 5-sided machining, molded parts, plates or saw cuts – the KONTEC KSC allows for high clamping forces in flat designs.

Workpieces can be clamped in less than one second. A preloaded center bearing free from play, as well as fitted slides ensure a repeat accuracy of up to +/- 0.01 mm, providing precise raw and finished part machining in a single clamping system.

For more information, visit SCHUNK’s website.

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