Electronics Weekly – Microchip eSPI to LPC Bridge, TI 12-bit ADC and More
Vincent Charbonneau posted on May 31, 2019 |

Analog Devices Impedance & Potentiostat Analog Front End for Biological and Chemical Sensing

AD5940 analog front end. (Image courtesy of Analog Devices.)
AD5940 analog front end. (Image courtesy of Analog Devices.)

Analog Devices has announced an electrochemical and impedance measurement front end that enables the next generation of vital sign monitoring devices and intelligent electrochemical sensors. The AD5940 analog front end incorporates both potentiostat and electrochemical impedance spectroscopy (EIS) functionality on one chip, allowing for sensor measurement in both time and frequency domains.

For more information, visit Analog Devices’ website.

Microchip eSPI to LPC Bridge

ECE1200 bridge. (Image courtesy of Microchip.)
ECE1200 bridge. (Image courtesy of Microchip.)

Microchip has launched its ECE1200 bridge. As the industrial computing industry transitions from Low Pin Count (LPC) to enhanced Serial Peripheral Interface (eSPI) bus technology, developers face high development costs to update existing equipment to the new standard. The ECE1200 bridge allow developers to implement the eSPI standard while preserving large investments in legacy LPC equipment.

Designed for today’s eSPI requirements, the ECE1200 detects and supports Modern Standby mode with low standby current. This helps industrial computing developers manage operating costs and efficiencies, while maintaining the features end users expect from modern devices. The ECE1200 is simple to implement and does not require any software.

For more information, visit Microchip’s website.

Synopsys Enhanced Verification Continuum Platform

Verification Continuum Platform. (Image courtesy of Synopsys.)
Verification Continuum Platform. (Image courtesy of Synopsys.)

Synopsys has introduced the latest version of its Verification Continuum Platform, which includes native integrations across verification tools, providing up to 5X higher verification performance.

Increasing system-on-chip (SoC) complexity, growing SoC software content and rising time-to-market pressures are driving the need for an efficient verification platform. Enhanced native integrations in Verification Continuum allow performance gains between all verification engines, accelerating time-to-market for complex SoC designs.

For more information, visit Synopsys’ website.

TI 12-bit ADC

ADC12DJ5200RF. (Image courtesy of Texas Instruments.)
ADC12DJ5200RF. (Image courtesy of Texas Instruments.)

Texas Instruments (TI) has developed an analog-to-digital converter (ADC) with an improved, sampling rate and low power consumption. The ADC12DJ5200RF helps users achieve high measurement accuracy for 5G testing applications and oscilloscopes, and direct X-band sampling for radar applications.

For more information, visit TI’s website.

TT Electronics Reverse Bayonet Connector

SteadiShield connector. (Image courtesy of TT Electronics.)
SteadiShield connector. (Image courtesy of TT Electronics.)

TT Electronics has unveiled its SteadiShield connector and OcTrain 10Gb Ethernet contact. The SteadiShield is a reverse bayonet connector suited for designs requiring one connector with multiple Ethernet screens. A metalized insert provides instant screen termination within a common ground for improved reliability.

On the other hand, the OcTrain contact meets high speed connection requirements to aid heavy data consumption in harsh environments. This contact is suitable for 22 and 24AWG wire, CAT 6A and CAT 7 cable, and a range of cable jackets from 4mm to 8.1mm.

For more information, visit TT Electronics’ website.

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