Electronics Weekly – LG AI Chip, u-blox Wireless Modules & More
Vincent Charbonneau posted on May 29, 2019 |

LG AI Chip

AI chip. (Image courtesy of LG.)
AI chip. (Image courtesy of LG.)
LG has developed an artificial intelligence chip (AI Chip) with its LG Neural Engine to better mimic the neural network of the human brain, in turn improving the processing of deep learning algorithms.

Using visual intelligence, the AI Chip is able to better recognize and distinguish space, location, objects and users. Voice intelligence allows the chip to accurately recognize voices and noise characteristics, while product intelligence enhances the capabilities of the device by detecting physical and chemical changes in the environment.

For more information, visit LG’s website.

Microsemi Carrier-Grade Time and Synchronization

TimeProvider 4100 release 2.0. (Image courtesy of Microsemi.)
TimeProvider 4100 release 2.0. (Image courtesy of Microsemi.)
Microsemi has updated its Precision Time Protocol (PTP) PackeTime lineup with Release 2.0 of TimeProvider 4100. The release adds 10 Gigabit Ethernet (GE) support, a Boundary Clock operation mode that lowers operational costs and other enhancements to improve how timing flows are distributed from multiple sources to a network's base stations and other endpoints.

In addition, PTP client capacity has been increased to 790 to provide scalability that is important for deployments in mobile network aggregation layers and DOCSIS 3.1 Remote-PHY cable architectures.

For more information, visit Microsemi’s website.

Samsung GAA Process

GAE PDK version 0.1. (Image courtesy of Samsung.)
GAE PDK version 0.1. (Image courtesy of Samsung.)
Samsung has introduced its 3nm Gate-All-Around process (3GAE). Compared to 7nm technology, the 3GAE process is designed to provide up to a 45 percent reduction in chip area with 50 percent lower power consumption or 35 percent higher performance. The GAA-based process node is expected to be adopted in next-generation applications, such as mobile, network, automotive, AI and IoT.

For more information, visit Samsung’s website.

Synopsys Intelligent Computer Vision Processing SoCs

DesignWare ARC EV6x Embedded Vision Processor. (Image courtesy of Synopsys.)
DesignWare ARC EV6x Embedded Vision Processor. (Image courtesy of Synopsys.)
Synopsys and Kudan have partnered to optimize Kudan’s SLAM computer software algorithms for Synopsys’ DesignWare ARC EV6x Embedded Vision Processor IP. The SLAM software algorithms create and expand a map of an environment while simultaneously keeping track of the camera’s location within it. SLAM is used in autonomous vehicles, drones, robots and augmented reality applications for concurrent scene mapping and device localization.

DesignWare ARC EV6x IP cores, on the other hand, are optimized for embedded vision applications, combining various software and hardware systems.

For more information, visit Synopsys’ website.

u-blox Wireless Modules

NINA wireless modules. (Image courtesy of u-blox.)
NINA wireless modules. (Image courtesy of u-blox.)
u-blox and SolidRun have collaborated to produce a range of connectivity devices for IoT, including turnkey IoT Edge Gateways for indoor and outdoor use, Single‑Board Computers (SBCs) and System-on‑Modules (SOMs). The models each incorporate a u-blox NINA standalone single, dual or multi‑radio module, providing the connectivity required by IoT applications in a small and low-power format.

For more information, visit u-blox’s website.

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