Electronics Weekly – Renesas Solid Material Detection, TT Thermal Jumper Chip and More
Vincent Charbonneau posted on April 26, 2019 |

Maxim Transceiver

MAX22513 transceiver. (Image courtesy of Maxim.)
MAX22513 transceiver. (Image courtesy of Maxim.)

Maxim has launched its MAX22513 surge-protected, dual-driver IO-Link device transceiver with integrated DC-DC buck regulator. It is suited for industrial IO-Link sensors and actuator devices.

The integrated surge protection and reverse polarity ensure communications in harsh industrial environments. The IC operates over the -40 degree Celsius to +125 degree Celsius temperature range and is available in both a 28-pin QFN package (3.5mm x 5.5mm) and a WLP (4.1mm x 2.1mm).

For more information, visit Maxim’s website.

Pasternack Skew Matched Cable Pairs

Skew matched cable pairs. (Image courtesy of Pasternack.)
Skew matched cable pairs. (Image courtesy of Pasternack.)

Pasternack has extended its skew matched cable pair line to include 40 GHz and 67 GHz models that are suited for high-data-rate digital systems development. These delay matched cables feature polarity indicators for matched cable ends and are available with 2.92 mm or 1.85 mm connectors. Performance specs include delay match as low as 1 ps and VSWR of 1.4:1. These cable pairs are also flexible and are all available for same-day shipping.

For more information, visit Pasternack’s website.

Renesas Solid Material Detection

Materials Detection Solution. (Image courtesy of Renesas Electronics.)
Materials Detection Solution. (Image courtesy of Renesas Electronics.)

Renesas Electronics has introduced its Material Detection Solution, which can detect materials or liquids without sensors by connecting electrodes using the company’s RX130 capacitive touch-key microcontrollers (MCUs). Replacing the sensors with this electrode approach contributes to lower overall costs while providing detection at multiple points using a single chip. This allows industrial equipment, OA equipment and home appliance manufacturers to explore detection systems for cost-constrained applications.

For more information, visit Renesas’ website.

RS Components Cloud IoT Development Board

PIC-IoT WG development board. (Image courtesy of RS Components.)
PIC-IoT WG development board. (Image courtesy of RS Components.)

RS Components has announced the availability of a development board that makes it simpler for engineers to create secure cloud-connected designs. The PIC-IoT WG development board provides a way to develop PIC microcontroller-based applications and connect them to the Google Cloud IoT Core platform, which gives users the ability to collect, process and analyze data in real time.

For more information, visit RS Components’ website.

TT Thermal Jumper Chip

TJC series thermal jumper chips. (Image courtesy of TT Electronics.)
TJC series thermal jumper chips. (Image courtesy of TT Electronics.)

TT Electronics has unveiled its TJC series thermal jumper chips, letting circuit designers manage temperature rise in compact power electronic assemblies. These parts provide a thermally conductive pathway with electrical isolation for management of PCB hotspot areas. Aluminum nitride, which has nearly five times the thermal conductivity of alumina, is employed in the thermal jumper chip to keep electronic assemblies cooler, which in turn improves reliability.

The TJC series has greater thermal conductivity than the equivalent footprint of 70µ copper, and gives better thermal connection than an uninterrupted trace. The component’s reduced mass and design (available in a case size as small as 0603) minimizes PCB area and total assembly size and weight.

For more information, visit TT Electronics’ website.

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