EW – Production Edition – Advantest Photoacoustic Microscope, Nordson Powder Coating Gun Controller & More
Vincent Charbonneau posted on March 27, 2019 |

Advantest Photoacoustic Microscope

Hadatomo Z microscope. (Image courtesy of Advantest.)
Hadatomo Z microscope. (Image courtesy of Advantest.)

Advantest has developed a photoacoustic microscope: the Hadatomo Z. The Hadatomo Zis equipped with a measurement unit mounted on a flexible arm, built on a system unit with caster wheels. It can radiate photoacoustic waves with two different wavelengths alternately. Applications for the Hadatomo Z are varied, and include ultrasonic measurement for analysis of the epidermis/dermis, including unevenness of skin, pores or sebaceous glands.

For more information, visit Advantest’s website.

AM Shift from Near-Memory to In-Memory Compute

(Image courtesy of Applied Materials.)
(Image courtesy of Applied Materials.)

Applied Materials (AM) has published an article concerning Moore’s Law and the shift from near-memory to in-memory compute. According to AM’s David Thompson, “We’ve made tremendous progress as an industry in decreasing the size, cost and power requirements of chips concurrently through Moore’s Law scaling… This triple win of power-cost-performance from scaling (or making things smaller cost less because it uses less silicon and less power for the same performance) has allowed the industry to be less reliant on disrupting the traditional Von Neumann compute paradigm.”

Thompson also states that “Von Neumann computing, at its heart, is about taking input data and moving it between memory where it’s stored and logic where it’s manipulated to the rhythm of a clock. All data is stored in memory and then transported to a calculation engine. Shuttling around all this data carries with it a significant power and performance tax that’s largely been masked due to the astounding progress made through Moore’s Law scaling.”

For more information, visit AM’s website.

Heraeus Semiconductor Bonding Wire

AgCoat Prime bonding wire. (Image courtesy of Heraeus Electronics.)
AgCoat Prime bonding wire. (Image courtesy of Heraeus Electronics.)

Heraeus Electronics has introduced AgCoat Prime—a silver alloy bonding wire coated with a layer of gold that is useful for semiconductor manufacturing.Because the specifications of AgCoat Prime are closely aligned to gold bonding wire, no inert gas is required, meaning no investment or changes to production equipment and facilities are necessary. It offers essentially a plug-and-play solution for ball bonding machines.

For more information, visit Heraeus’ website.

Manncorp Benchtop Batch Reflow Oven

MC-301 benchtop batch reflow oven. (Image courtesy of Manncorp.)
MC-301 benchtop batch reflow oven. (Image courtesy of Manncorp.)

Manncorp demoed several of its recent product families at this year’s IPC APEX Expo. One such device is the MC-301 benchtop batch reflow oven, which is suitable for product development and prototyping within a small footprint. The hardware control app and Android architecture allows for easy programming of detailed solder profiles, making this oven useful for manufacturability testing, among other applications.

For more information, visit Manncorp’s website.

Nordson Modular Powder Coating Gun Controller

Encore Enhance controller. (Image courtesy of Nordson.)
Encore Enhance controller. (Image courtesy of Nordson.)

Nordson has unveiled its Encore Enhance modular powder coating gun controller. The controller includes features such as peer-to-peer communication between each controller interface for “one-touch” triggering, grouping, coating recipe selection and recipe copying.Additionally, Enhance allows users to control both traditional venturi pump applications and also dense phase applications with the addition of an Encore HD Pump Cabinet.

For more information, visit Nordson’s website.

Missed the last EW – Production Edition? Click here.


Recommended For You