Electronics Weekly – Pasternack Coaxial RF Probes, RS Components Soldering Station and More
Vincent Charbonneau posted on January 11, 2019 |

Microchip Development of Remote IoT Nodes

SAM R34/R35 SiPs. (Image courtesy of Microchip.)
SAM R34/R35 SiPs. (Image courtesy of Microchip.)

Microchip has introduced a LoRa System-in-Package (SiP) family with a low power 32-bit microcontroller (MCU), sub-GHz RF LoRa transceiver and software stack. This technology is designed to help accelerate the development of remote Internet of Things (IoT) nodes.

LoRa technology allows low power applications to communicate over longer ranges than Wi-Fi or Bluetooth by using the LoRaWAN open protocol. Suited for a range of applications such as smart cities, agricultural monitoring and supply chain tracking, LoRaWAN allows for the creation of IoT networks that can operate in both urban and rural environments.

For more information, visit Microchip’s website.

Microsemi Passive Optical Network Applications with a FPGA Burst Mode Receiver

PolarFire FPGA. (Image courtesy of Microsemi.)
PolarFire FPGA. (Image courtesy of Microsemi.)

Microsemi has launched its PolarFire FPGA burst mode receiver (BMR), which supports 10G passive optical network (PON) optical line terminal (OLT) capabilities with a field programmable gate array (FPGA) for 10G PON OLT implementation in a compact form factor.

Customizable, and featuring 10.8 nanosecond lock times in midrange FPGAs for PONs, the BMR provides a PON system in small optical module-based form factors. As an increasingly popular telecommunications technology that is used to provide fiber to end customers, PONs implement a point-to-multipoint architecture using unpowered fiber-optic splitters to enable a single optical fiber serving multiple end points.

For more information, visit Microsemi’s website.

Pasternack Coaxial RF Probes

Coaxial RF probes. (Image courtesy of Pasternack.)
Coaxial RF probes. (Image courtesy of Pasternack.)

Pasternack has released a line of RF coaxial probes with a 40GHz operating frequency range for use in microwave components, high-speed communications and networking. The probes include four models that provide 10dB maximum return loss over the frequency range of DC-40GHz. They are offered in GS and GSG configurations with a pitch of 800 or 1500 microns and a 2.92mm interface.

For more information, visit Pasternack’s website.

RS Components Dual-Channel Soldering Station

RS Pro dual-channel soldering station. (Image courtesy of RS Components.)
RS Pro dual-channel soldering station. (Image courtesy of RS Components.)

RS Components has unveiled its RS Pro dual-channel soldering station. Offering a combined maximum power output of 200W, the station allows for the simultaneous use of a soldering iron and tweezers, both of which are included in the package, along with the main heating unit and two tool holders.

With fast heat-up and recovery, the supplied soldering iron has a power output of 130W and can reach maximum temperature within 10 seconds.

For more information, visit RS Components’ website.

Synopsys Modeling Standards to Address Design Down to 2nm

Fusion Design Platform. (Image courtesy of Synopsys.)
Fusion Design Platform. (Image courtesy of Synopsys.)

Synopsys has announced that the Liberty Technical Advisory Board (LTAB) and Interconnect Modeling Technical Advisory Board (IMTAB) have ratified new modeling constructs to address timing and parasitic extraction challenges at process nodes down to two nanometers (nm).

Mobile device requirements for low power and manufacturing challenges require different approaches to help provide the best accuracy at signoff while enabling design tools to reduce power consumption. In addition, the Synopsys Fusion Design Platform can help engineers address the artifacts produced by device architectures, mask and patterning techniques at these nodes, which must be modeled by improved extensions in the interconnect technology file (ITF).

For more information, visit Synopsys’ website.

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