Electronics Weekly – Pasternack Military-grade RF Cable Assemblies, TI Multiprotocol Processors & More
Vincent Charbonneau posted on November 07, 2018 |

Analog Devices Video Transceivers

C2B Transceivers. (Image courtesy of Analog Devices.)
C2B Transceivers. (Image courtesy of Analog Devices.)

Analog Devices announced a transceiver series that enables HD video over existing Unshielded Twisted Pair cables and unshielded connectors.This allows OEMs to upgrade easily from standard-definition cameras to HD cameras and provide the increased resolution and image quality required for today’s automotive camera applications.

The C2B transceivers are designed specifically for automotive applications. This means that along with supporting visual quality over the unshielded infrastructure, care was also taken with on-chip EMC/EMI mitigation techniques to provide compliance to industry mandates for EMC, EMI and ESD.

For more information, visit Analog Devices’ website.

Pasternack Military-grade RF Cable Assemblies

MIL-DTL-17 Cable Assemblies. (Image courtesy of Pasternack.)
MIL-DTL-17 Cable Assemblies. (Image courtesy of Pasternack.)

Pasternack introduced a line of military-grade MIL-DTL-17 RF cable assemblies for avionics, military electronics, satellite ground stations and autonomous vehicles. The cable assemblies consist of 124 basic configurations from six cable types with more than 700 part numbers. These cables provide operating frequencies of up to 12.4 GHz and VSWRas low as 1.3:1 per connector.

For more information, visit Pasternack’s website.

RS Components Backplane Ethernet Connectors

Hirose ER8 series of 0.8mm board-to-board connectors. (Image courtesy of RS Components.)
Hirose ER8 series of 0.8mm board-to-board connectors. (Image courtesy of RS Components.)

RS Components launched the Hirose ER8 series of 0.8mm board-to-board connectors for industrial and medical applications. ER8 series PCB connectors combine hardened construction with high-speed transmission at data rates of over 10 Gbps, exceeding the IEEE802.3ap backplane Ethernet specification.

In addition, ER8 connectors feature an extended contact wipe and insertion depth to keep the mating force low, while the extraction force is up to six times greater than a typical micro-pitch connector.

For more information, visit RS Components’ website.

Samsung Smartphone Image Sensors

ISOCELL GM1 and GD1 sensors. (Image courtesy of Samsung.
ISOCELL GM1 and GD1 sensors. (Image courtesy of Samsung.

Samsung released two 0.8μm pixel image sensors—the 48Mp Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL Bright GD1.The GM1 and GD1 sensors are based on the company’s pixel isolation technology, the ISOCELL Plus, which optimizes performance especially for smaller-dimension pixels, making them ideal for today’s high-resolution cameras.

In addition, thanks to Tetracell technology—where four pixels are merged to work as one to increase light sensitivity—the GM1 and GD1 can provide light sensitivity equivalent to that of a 1.6μm-pixel image sensor at 12Mp and 8Mp resolution, respectively.

For more information, visit Samsung’s website.

TI Multiprotocol Processors for Industry 4.0

TSN-enabled processors. (Image courtesy of Texas Instruments.)
TSN-enabled processors. (Image courtesy of Texas Instruments.)

Texas Instruments (TI) unveiled a multiprotocol gigabit time-sensitive networking (TSN)-enabled processor family. The Sitara AM6x processor line provides industrial-grade reliability with quad and dual Arm Cortex-A53 core variants built to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid infrastructure.

The inclusion of an on-chip isolated dual-core microcontroller (MCU) subsystem lets designers use the processors to create more dependable and functional safety-certifiable products while reducing overall system-level complexity for applications including programmable logic controllers (PLC) and multi-axis motor drives.

For more information, visit TI’s website.

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