EW – Design Edition – Cadence 3D Design, Fujitsu Digital Production Tool & More
Vincent Charbonneau posted on August 01, 2018 |

Cadence 3D Design & Analysis

Sigrity 2018. (Image courtesy of Cadence.)
Sigrity 2018. (Image courtesy of Cadence.)

Cadence has announced the 2018 release of its Sigrity software, which includes 3D capabilities that allow PCB design teams to accelerate design cycles while optimizing cost and performance. A 3D design and 3D analysis environment integrating Sigrity tools with Cadence Allegro provides a more efficient and less error-prone system utilizing third-party modeling tools, saving days of design cycle time and reducing risk.

In addition, a 3D Workbench methodology bridges the gap between the mechanical and electrical domains, enabling product development teams to quickly and accurately analyze signals that cross multiple boards. Sigrity 2018 also provides Rigid-Flex support for field solvers such as the Sigrity PowerSI technology.

For more information, visit Cadence’s website.

Fujitsu Digital Production Preparation Tool

VPS V15L20 software. (Image courtesy of Fujitsu.)
VPS V15L20 software. (Image courtesy of Fujitsu.)

Fujitsu has launched the latest version of its Manufacturing Industry Solution VPS, V15L20. Like its predecessor, V15L20 manages 3D model-derived data, including information on the procedures and workloads involved in assembly work. At the same time, this version also enables the consolidation and display of a wider array of production data, such as video images of the work of actual machinery and inspection sheets on task performance.

When confirming the production flow, the window size and layout for displaying the assembly parts configuration tree diagram can be recalled, with multiple patterns saved. The VPS tool also accommodates integrated and cut-away displays for each window, as well as multi-displays. Display windows can be customized to make them easy to use for each user.

Additional technical specifications are available on Fujitsu’s website.

Imagination Neural Network Accelerator Cores

PowerVR Series2NX neural network cores. (Image courtesy of Imagination Technologies.)
PowerVR Series2NX neural network cores. (Image courtesy of Imagination Technologies.)

Imagination Technologies has announced two neural network cores, the AX2185 and AX2145, designed to provide high-performance computation of neural networks at low power consumption in a minimal silicon area. The cores are based on Imagination’s neural network accelerator (NNA) architecture, PowerVR Series2NX, which features the ability to move from the cloud into edge devices, creating greater efficiency and real-time responsiveness.

The Series2NX AX2185 targets the smartphone, smart surveillance and automotive markets, where neural network acceleration has an impact in areas such as image categorization and driver assistance systems. Featuring eight full-width compute engines, the AX2185 provides 2,048 MACs/clock (4.1 Tera Operations per second).

For more information, visit Imagination Technologies’ website.

Renesas Model-Based Development Environment

Model-based development environment. (Image courtesy of Renesas.)
Model-based development environment. (Image courtesy of Renesas.)

Renesas has created an update to its “Embedded Target for RH850 Multicore” model-based development environment for multicore microcontrollers (MCUs) intended for automotive control applications. The update supports the development of systems with multi-rate control (multiple control periods), which is now common in engine and body control systems.

The model-based development environment has become practical even in software development scenarios for multicore MCUs, and can reduce the increasingly complex software development burdens especially in control system development of self-driving cars.

Pricing and availability information can be found on Renesas’ website.

Zuken Single and Multi-board PCB Design

CR-8000 2018. (Image courtesy of Zuken.)
CR-8000 2018. (Image courtesy of Zuken.)

Zuken has unveiled the most recent version of its system-level PCB design environment, CR-8000 2018. CR-8000 has system-level engineering and 2D/3D multi-board implementation capabilities. The CR-8000 family of applications spans the complete PCB engineering lifecycle: from system-level planning, through implementation and design for manufacturability. The CR-8000 environment also includes 3D IC packaging and chip/package/board co-design.

The 2018 release focuses on providing efficient front-loading of design constraints and specifications to the design creation process, coupled with placement and routing capabilities for physical layout. This will increase efficiency and ensure quality through streamlined collaboration across the PCB design chain.

For more information, visit Zuken’s website.

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