EW – Design Edition – Cadence Cloud Semiconductor Design, Silvaco Machine Learning & More
Vincent Charbonneau posted on July 05, 2018 |

Cadence Cloud Semiconductor Design Platform

Cadence Cloud platform. (Image courtesy of Cadence.)
Cadence Cloud platform. (Image courtesy of Cadence.)

Cadence has launched its Cadence Cloud portfolio, a cloud-based system for the development of electronic systems and semiconductors. The portfolio consists of Cadence- and user-managed environments that enable electronic product developers to use the scalability of the cloud to securely manage the exponential increases in design complexity.

“The cloud will fundamentally influence silicon design by giving semiconductor companies the ability to optimize their capital versus operational expenses for computing infrastructure,” said Suk Lee, director of Design Infrastructure Marketing at TSMC. “Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.”

For more information, visit Cadence’s website.

Mentor IC Design Signoff Software

Calibre RealTime Digital software. (Image courtesy of Mentor.)
Calibre RealTime Digital software. (Image courtesy of Mentor.)

Mentor has announced its Calibre RealTime Digital software—a physical verification tool that works in concert with commercial place-and-route environments to ensure “Correct-by-Calibre” routing, and help design teams cut weeks off of IC signoff.

Calibre RealTime Digital is the sister product to Mentor’s Calibre RealTime Custom tool that was introduced in 2011 for custom IC design flows. Targeting the full-chip and block-level digital market, this tool is suited for teams designing primarily ASICs and system on chips (SoCs) for a range of end products, including mobile phones, automobiles, wired and wireless infrastructure equipment, and other industrial and commercial applications.

Additional technical details are available on Mentor’s website.

National Instruments RFIC Measurement System

NI-RFmx NB-IoT/eMTC measurement software. (Image courtesy of National Instruments.)
NI-RFmx NB-IoT/eMTC measurement software. (Image courtesy of National Instruments.)

National Instruments has launched its NI-RFmx NB-IoT/eMTC measurement software, which supplements the company’s existing RF test capabilities for wireless technologies ranging from 802.11a/b/g/n/ac/ax, to Bluetooth, to 2G/3G/4G/5G standards.

NB-IoT and eMTC drive a variety of machine-type communication applications by providing performance criteria such as extended range and lower power consumption. Compared to existing LTE technology, the NB-IoT and eMTC standards extend range through link budget improvements and improve power consumption via narrower bandwidths and simplified radio designs.

For more information, visit National Instruments’ website.

Silvaco Machine Learning Technology

VarMan verification tool. (Image courtesy of Silvaco.)
VarMan verification tool. (Image courtesy of Silvaco.)

Silvaco recently showcased its suite of machine learning-enabled silicon systems at the Design Automation Conference 2018 in San Francisco, Calif. One such system is VarMan, a Variation Aware design verification tool that allows chip designers to achieve high sigma for analog blocks, standard cells libraries and memories.

In addition, using neural network algorithms, the company’s TechModeler creates accurate behavioral Verilog-A spice models with a small number of input samples. Also, Silvaco’s Cello is automating standard cell library creation, migration and optimization, as well as exploiting dimensionality reduction algorithms applied to the SPICE model’s variation parameters, to optimize statistical characterization runtime.

For more information, visit Silvaco’s website.

Zuken Harness Analyzer

E3.HarnessAnalyzer software. (Image courtesy of Zuken.)
E3.HarnessAnalyzer software. (Image courtesy of Zuken.)

Zuken’s wire harness visualization and analysis software, E3.HarnessAnalyzer, has been improved to support the latest industry standard data formats, visualize harness data in 3D, and automatically compile schematic drawings for the displayed modules. With these capabilities, E3.HarnessAnalyzer lets OEMs and suppliers open, inspect and collaborate on previously proprietary harness design data generated by different authoring tools used in the industry.

The range of supported import formats has been extended to include native PLMXML and DSI capabilities. In addition, E3.HarnessAnalyzer now supports the import of data in the most recent Vehicle Electric Container (VEC) industry standard format, thereby enabling review and inspection capabilities for 150 percent wire harness designs, including their range of options and variants.

For more information, visit Zuken’s website.

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