EW – Assembly Edition – AMETEK Polyethylene Molding, SCHUNK Gripping Systems & More
Vincent Charbonneau posted on June 27, 2018 |

AMETEK Polyethylene Molding

Polyethylene molding capabilities. (Image courtesy of AMETEK.)
Polyethylene molding capabilities. (Image courtesy of AMETEK.)

AMETEK announced its development of polyethylene molding capabilities. Polyethylene has been recognized as a preferred material for undersea cables and terminators due to its lower permeability to seawater.

The company has focused on polyethylene molding because of its long life and reliability for full depth rated sea floor applications with embedded sensors and payloads.The capabilities of AMETEK’s polyethylene cable splices, breakouts and connector terminations can be provided at the factory or in the field.

For more information, visit AMETEK’s website.

Amphenol Industrial High-current Compression Lugs

SurLok Plus compression lugs. (Image courtesy of Amphenol.)
SurLok Plus compression lugs. (Image courtesy of Amphenol.)

Amphenol stated that its SurLok Plus line is now certified to UL 1977 in all sizes, including 5.7mm, 8.0mm and 10.3mm. SurLok Plus is a high-current compression lug designed to meet the needs of energy storage for commercial and residential battery storage systems, as well as electric and hybrid electric vehicles.

This quick connect and locking system is available in three termination styles including crimp, busbar lug and threaded post. SurLok Plus is optimized for battery pack connections from 50 A to 400 A using a touch-safe interface and increases amperage while reducing insertion force, temperature rise and voltage drop.

Additional technical information is available on Amphenol’s website.

Littelfuse SiC Schottky Diodes

GEN2 Series 1200 V, 3L TO-247 and 2L TO-263 Schottky Diodes. (Image courtesy of Littelfuse.)
GEN2 Series 1200 V, 3L TO-247 and 2L TO-263 Schottky Diodes. (Image courtesy of Littelfuse.)

Littelfuse introduced a portfolio of silicon carbide (SiC) power semiconductor devices comprised of five GEN2 Series 1200 V, 3L TO-247 Schottky Diodes and three GEN2 Series 1200 V, 2L TO-263 Schottky Diodes. When compared with silicon devices, GEN2 SiC Schottky Diodes reduce switching losses and allow for increases in the efficiency and robustness of power electronics’ systems.

The 3L TO-247 GEN2 SiC Schottky Diodes are available with current ratings of 10 A, 15 A, 20 A, 30 A and 40 A.All have negligible reverse recovery current, accommodate high surge currents without thermal runaway and operate at junction temperatures as high as 175 °C.

For more information, visit Littelfuse’s website.

Masterbond Two Part Epoxy

Supreme 62-1 two part epoxy. (Image courtesy of Masterbond.)
Supreme 62-1 two part epoxy. (Image courtesy of Masterbond.)

Masterbond developed a solvent free, two component epoxy system called Supreme 62-1. It is serviceable from -51°C to +232°C. Supreme 62-1 provides chemical resistance to a range of acids, bases, fuels and solvents, even at elevated temperatures. It can be used as an adhesive/sealant for aerospace, electronic, optical and specialty OEM applications.

This compound has an elongation of 5-10 percent and a Shore D hardness of 75-85. Volume resistivity of the cured epoxy exceeds 1014 ohm-cm. Supreme 62-1 is available in ½ pint, pint, quart, gallon and 5-gallon kits. Specialty packaging in premixed and frozen syringes and in gun kits are available to simplify handling, minimize waste and speed productivity.

Information concerning pricing and availability can be found on Masterbond’s website.

SCHUNK Gripping Systems

Library of mechatronic gripping systems components. (Image courtesy of SCHUNK.)
Library of mechatronic gripping systems components. (Image courtesy of SCHUNK.)

SCHUNK and Siemens have joined forces to create a starter kit made up of Mechatronics Concept Designer software from Siemens PLM Software, a component library of digital twins from SCHUNK and corresponding support for their use. The tool can be integrated into Siemens’ NX software.

SCHUNK built its 24 V mechatronics program for high-performance assembly as digital twins, so that simple assembly systems can also be simulated without comprehensive software expertise. The component library comprises in the first stage the parallel grippers SCHUNK EGP, linear modules SCHUNK ELP, rotary gripping modules EGS and rotary modules ERS.

For more information, visit SCHUNK’s website.

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