About Don Scansen
Don Scansen
Don Scansen is a partner at IP Research Group, a technology consulting firm delivering unparalleled service to intellectual property clients. Don spent more than ten years as a reverse engineer and in various management roles at Chipworks and Semiconductor Insights. He holds a Ph.D. in Electrical Engineering from the University of Saskatchewan and is a licensed professional engineer in the Province of Ontario.

From stacked chip packages to monolithic 3DICs More >>

 

Next-gen phones could have 30 MEMS components More >>

 

The electronics inside digital pianos. More >>

 

More changes inside than out. More >>

 

New smartphone designs are gaining customers for good reason. More >>

 

How the files survive even when the battery dies. More >>

 

The main components of the ubiquitous touchscreen interface. More >>

 

eDRAM, Iris Pro and the new Haswell devices. More >>

 

Smartphone APUs combine the best of both SoC and SiP technology. More >>

 

Flexible form factors and new battery chemistry. More >>

 

What physics limits how thin smartphones can be? More >>

 

BlackBerry launched their newest smart phone this week. Will the Q10 bring BlackBerry back? More >>

 

Intel paper describes their direction for DRAM. More >>

 

It’s been forty years since the first mobile phone call. More >>

 

Is it possible that more phones were returned than shipped? More >>

 

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